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Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

  • US 8,310,057 B2
  • Filed: 12/09/2010
  • Issued: 11/13/2012
  • Est. Priority Date: 03/27/1998
  • Status: Expired due to Fees
First Claim
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1. A substrate comprising:

  • an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film;

    a wiring pattern that is adhered to the first surface of the insulating film by an adhesive material, a first portion of the wiring pattern formed over the penetrating hole, a part of the adhesive material formed on a first part of an internal wall surface so as not to stop up the penetrating hole, the adhesive material not being in contact with a second part of the internal wall surface, the internal wall surface forming the penetrating hole; and

    an external electrode that contacts the first portion of the wiring pattern and projecting through the penetrating hole and extending beyond the second surface of the insulating film, a first portion of the external electrode being in contact with a first part of a surface of the part of the adhesive material, the first part of the surface of the part of the adhesive material facing a first opening of the penetrating hole in the second surface of the insulating film, the first portion of the external electrode positioned within the penetrating hole.

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