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Semiconductor devices including voltage switchable materials for over-voltage protection

  • US 8,310,064 B2
  • Filed: 02/24/2011
  • Issued: 11/13/2012
  • Est. Priority Date: 11/22/2005
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • a dielectric substrate including, on a surface thereof, a conductor;

    a semiconductor die attached to the surface; and

    an underfill layer including a first voltage switchable material connecting the semiconductor die to the conductor, the first voltage switchable material physically contacting both the semiconductor die and the conductor,wherein the conductor is situated between a die attach adhesive and a die bonding pad.

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