Methods of implanting electronics in objects and objects with implanted electronics
First Claim
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1. A method comprising:
- encapsulating electronics in a heat resistant coating;
heating an object so as to cause at least a portion of a surface of the object to become softened;
implanting the encapsulated electronics into the object via the softened surface,the heat resistant coating encapsulating the electronics configured to protect the electronics from heat during implantation of the electronics in the object by allowing less heat to be transferred from the softened surface to the electronics than an amount of heat to destroy the electronics; and
performing post-implantation processing of the object, the post-implantation processing including at least one of annealing, grinding, polishing, peening, painting and varnishing.
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Abstract
Systems and methods including implanting RFID tags into metal-containing objects. The RFID tags are coated in a heat resistant coating. The surface of the metal-containing object could be heated and the coated RFID tag could be injected into the metal-containing object by allowing less heat to be transferred to the RFID electronics than an amount of heat to destroy the RFID electronics. The metal-containing objects can be monitored and tracked. Apparatus with implanted metal-containing objects can be remotely monitored and controlled.
34 Citations
24 Claims
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1. A method comprising:
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encapsulating electronics in a heat resistant coating; heating an object so as to cause at least a portion of a surface of the object to become softened; implanting the encapsulated electronics into the object via the softened surface, the heat resistant coating encapsulating the electronics configured to protect the electronics from heat during implantation of the electronics in the object by allowing less heat to be transferred from the softened surface to the electronics than an amount of heat to destroy the electronics; and performing post-implantation processing of the object, the post-implantation processing including at least one of annealing, grinding, polishing, peening, painting and varnishing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method comprising:
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encapsulating electronics in a heat resistant coating; heating an object so as to cause at least a portion of a surface of the object to become softened; implanting the encapsulated electronics into the object via the softened surface, the heat resistant coating encapsulating the electronics configured to protect the electronics from heat surrounding the electronics during implantation of the electronics into the object by allowing less heat to be transferred to the electronics from the softened surface than an amount of heat to destroy the electronics; and reforming the surface of the object after implanting the encapsulated electronics into the object. - View Dependent Claims (17)
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18. An object comprising:
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metal; and an electronic circuit encapsulated in a heat resistant coating and embedded in the metal, the heat resistant coating configured to protect the electronic circuit from heat surrounding the electronic circuit during implantation of the electronic circuit in the metal by allowing less heat to be transferred to the electronic circuit than an amount of heat to destroy the electronic circuit. - View Dependent Claims (19, 20, 21, 22, 23, 24)
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Specification