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Apparatus and methods for electrochemical processing of microfeature wafers

  • US 8,313,631 B2
  • Filed: 11/02/2010
  • Issued: 11/20/2012
  • Est. Priority Date: 01/29/2007
  • Status: Active Grant
First Claim
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1. A method for electrochemically processing a microfeature wafer, comprising:

  • holding a wafer in a wafer holder in a processing zone of a vessel;

    establishing an electric field in a processing fluid in the vessel using the wafer, a counter electrode in the vessel, and a supplementary electrode spaced apart from the wafer holder;

    wherein the supplementary electrode affects the electric field via a supplementary virtual electrode in the processing zone, and the supplementary electrode comprises an inclined annular ring oriented at a non-zero angle relative to the supplementary virtual electrode.

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