Method and system for optical MEMS with flexible landing structures

• US 8,314,984 B2
• Filed: 02/14/2008
• Issued: 11/20/2012
• Est. Priority Date: 02/14/2008
• Status: Active Grant

• Current Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Original Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Inventors: Yang, Xiao, Wang, Ye, Wang, Yuxiang, Payne, Justin, Ji, Wook
• Primary Examiner(s): Doak, Jennifer L.
• Application Number:
  US12/031,388
• Publication Number:
  US 20090231671A1
• Time in Patent Office: 1,741 Days
• Field of Search: 3591981-1994, 3592006-2008, 359/202.1, 359/221.2, 3592231-2251, 359/226.2, 359290-295, 359/838, 359/846, 359/871, 359/872, 250/204, 250/559.06, 250/559.29, 250/230, 250/234, 347255-260, 353/39, 353 98- 99, 385 15- 18, 385/22, 398/12, 398/19, 398/45
• US Class Current: 359/224.1
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

An optical deflection device for a display application includes a semiconductor substrate comprising an upper surface region defining an upper surface plane. The optical deflection device also includes one or more electrode devices provided overlying the upper surface region and a hinge device including a silicon material and coupled to the upper surface region at a predetermined height above the upper surface plane. The optical deflection device further comprises a plurality of landing pads including a silicon material and coupled to the upper surface region at the predetermined height from the upper surface plane and a mirror structure. The mirror structure includes a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion.

Claims

1. An optical deflection device for a display application, the optical deflection device comprising:

a semiconductor substrate comprising an upper surface region defining an upper surface plane;

one or more electrode devices provided overlying the upper surface region;

a hinge device comprising a silicon material and having an axis of rotation substantially parallel to the upper surface plane, wherein the axis of rotation is located at a predetermined height above the upper surface plane;

a plurality of landing pads comprising a silicon material and coupled to the upper surface region, wherein the plurality of landing pads are located at the predetermined height above the upper surface plane; and

a mirror structure comprising;

a post portion coupled to the hinge device, and

a mirror plate portion coupled to the post portion.

2. The optical deflection device of claim 1 wherein a lower side of the mirror plate portion is configured to make contact with one of the plurality of landing pads in a first activated position.

3. The optical deflection device of claim 2 wherein the lower side of the mirror plate portion comprises a corner region of the mirror plate portion.

4. The optical deflection device of claim 2 wherein a lower side of the mirror plate portion is configured to make contact with another of the plurality of landing pads in a second activated position.

5. The optical deflection device of claim 2 wherein the one of the plurality of landing pads deforms in response to the contact.

6. The optical deflection device of claim 1 wherein a thickness of the hinge device and a thickness of the plurality of landing pads are defined by a same thickness.

7. The optical deflection device of claim 1 wherein the silicon material comprises single crystal silicon.

8. The optical deflection device of claim 1 wherein the semiconductor substrate comprises a CMOS substrate.

9. The optical deflection device of claim 1 wherein the mirror structure comprises a silicon material.

10. The optical deflection device of claim 9 wherein the silicon material of the mirror structure comprises at least one of amorphous silicon, a polysilicon, or a silicon/metal alloy.

11. An array of optical deflection devices for a display application, the array of optical deflection devices comprising:

a semiconductor substrate comprising an upper surface region defining an upper surface plane;

a plurality of sets of electrode devices arrayed over the upper surface region;

a plurality of hinge devices, each of the plurality of hinge devices being associated with a set of electrode devices, wherein each of the plurality of hinge devices comprises a silicon material coupled to the upper surface region and has an axis of rotation substantially parallel to the upper surface plane, wherein the axis of rotation is positioned at a predetermined height above the upper surface plane;

a plurality of mirror structures, each of the plurality of mirror structures being joined to one of the plurality of hinge devices, wherein each of the plurality of mirror structures comprises;

a mirror anchor portion coupled to the one of the plurality of hinge devices, and

a mirror plate portion coupled to the mirror anchor portion; and

a plurality of sets of landing pads, each of the sets of landing pads being associated with one of the plurality of mirror structures, wherein each of the sets of landing pads comprises a silicon material and is coupled to the upper surface region, wherein each of the sets of landing pads is located at the predetermined height above the upper surface plane.

12. The array of optical deflection devices of claim 11 wherein a lower side of the mirror plate portion is configured to make contact with a portion of a landing pad of the set of landing pads in a first activated position.

13. The array of optical deflection devices of claim 12 wherein the lower side of the mirror plate portion comprises a corner region of the mirror plate portion.

14. The array of optical deflection devices of claim 11 wherein the silicon material comprises single crystal silicon.

15. The array of optical deflection devices of claim 11 wherein the semiconductor substrate comprises a CMOS substrate.

16. The array of optical deflection devices of claim 11 wherein the mirror structure comprises a silicon material.

17. The array of optical deflection devices of claim 16 wherein the silicon material of the mirror structure comprises at least one of amorphous silicon, a polysilicon, or a silicon/metal alloy.