Systems and methods for three-axis sensor chip packages
First Claim
1. A directional sensor package, the sensor package comprising:
- a base;
a first sensor die mounted to the base, the first sensor die having a first active sensor circuit and a first plurality of metal pads electrically coupled to the first active sensor circuit;
a second sensor die mounted to the base, the second sensor die having a second active sensor circuit located on a first surface, and a second plurality of metal pads electrically coupled to the second active sensor circuit, the second plurality of metal pads located on a second surface;
wherein the second sensor die is positioned such that the second active sensor circuit is oriented orthogonally with respect to the first active sensor circuit region and is perpendicular to the base;
wherein the second surface is adjacent to the first surface and angled with respect to a plane of the first surface.
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Accused Products
Abstract
Systems and methods for three-axis sensor chip packages are provided. In one embodiment, a directional sensor package comprises: a base; a first sensor die mounted to the base, the first sensor die having a first active sensor circuit and a first plurality of metal pads electrically coupled to the first active sensor circuit; a second sensor die mounted to the base, the second sensor die having a second active sensor circuit located on a first surface, and a second plurality of metal pads electrically coupled to the second active sensor circuit located on a second surface. The second sensor die is positioned such that the second active sensor circuit is oriented orthogonally with respect to the first active sensor circuit region and is perpendicular to the base. The second surface is adjacent to the first surface and angled with respect to a plane of the first surface.
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Citations
20 Claims
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1. A directional sensor package, the sensor package comprising:
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a base; a first sensor die mounted to the base, the first sensor die having a first active sensor circuit and a first plurality of metal pads electrically coupled to the first active sensor circuit; a second sensor die mounted to the base, the second sensor die having a second active sensor circuit located on a first surface, and a second plurality of metal pads electrically coupled to the second active sensor circuit, the second plurality of metal pads located on a second surface; wherein the second sensor die is positioned such that the second active sensor circuit is oriented orthogonally with respect to the first active sensor circuit region and is perpendicular to the base; wherein the second surface is adjacent to the first surface and angled with respect to a plane of the first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for fabricating a directional sensor, the method comprising:
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forming a groove in a wafer using a selective etch process; depositing metal pads on an angled surface within the groove and depositing a first active sensor circuit on a surface outside of the groove, wherein the first active sensor circuit is electrically coupled to the metal pads; singulating the wafer to obtain an individual sensor die; vertically mounting the sensor die onto a base such that the first active sensor circuit is vertical to the base and the metal pads are positioned on the sensor die opposite from the base; interconnecting the active sensor circuit to another circuit by installing wirebonds onto the metal pads. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A vertical sensor die for use in a three-axis sensor package, the vertical sensor die comprising:
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an active sensor circuit located on a first surface; and a plurality of metal pads electrically coupled to the active sensor located on a second surface; wherein the second surface is adjacent to the first surface and angled with respect to a plane of the first surface. - View Dependent Claims (19, 20)
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Specification