Systems and methods for three-axis sensor chip packages

• US 8,316,552 B1
• Filed: 05/05/2011
• Issued: 11/27/2012
• Est. Priority Date: 05/05/2011
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Withanawasam, Lakshman, Rieger, Ryan W., Pant, Bharat B
• Primary Examiner(s): FULTON, CHRISTOPHER W
• Application Number:
  US13/101,492
• Publication Number:
  US 20120279077A1
• Time in Patent Office: 572 Days
• Field of Search: 333/55.R, 324/247
• US Class Current: 33/355.R
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10155 being other than a cuboid

Abstract

Systems and methods for three-axis sensor chip packages are provided. In one embodiment, a directional sensor package comprises: a base; a first sensor die mounted to the base, the first sensor die having a first active sensor circuit and a first plurality of metal pads electrically coupled to the first active sensor circuit; a second sensor die mounted to the base, the second sensor die having a second active sensor circuit located on a first surface, and a second plurality of metal pads electrically coupled to the second active sensor circuit located on a second surface. The second sensor die is positioned such that the second active sensor circuit is oriented orthogonally with respect to the first active sensor circuit region and is perpendicular to the base. The second surface is adjacent to the first surface and angled with respect to a plane of the first surface.

Claims

1. A directional sensor package, the sensor package comprising:

a base;

a first sensor die mounted to the base, the first sensor die having a first active sensor circuit and a first plurality of metal pads electrically coupled to the first active sensor circuit;

a second sensor die mounted to the base, the second sensor die having a second active sensor circuit located on a first surface, and a second plurality of metal pads electrically coupled to the second active sensor circuit, the second plurality of metal pads located on a second surface;

wherein the second sensor die is positioned such that the second active sensor circuit is oriented orthogonally with respect to the first active sensor circuit region and is perpendicular to the base;

wherein the second surface is adjacent to the first surface and angled with respect to a plane of the first surface.

2. The sensor package of claim 1, wherein the first active sensor circuit comprises a two-axis sensor;

and

wherein the second active sensor circuit comprises a one-axis sensor oriented orthogonally with respect to the two-axis horizontal sensor.

3. The sensor package of claim 1, wherein second active sensor circuit comprises a two-axis sensor;

and

wherein the first active sensor circuit comprises a one-axis sensor oriented orthogonally with respect to the two-axis sensor.

4. The sensor package of claim 1, further comprising:

one or more wirebond connections interconnecting the first plurality of metal pads of the first sensor die with the second plurality of metal pads of the second sensor die.

5. The sensor package of claim 1, further comprising:

one or more wirebond connections interconnecting the second plurality of metal pads of the second sensor die with one or more metal pads formed on the base.

6. The sensor package of claim 1, further comprising die attachment material mechanically coupling the first sensor die and the second sensor die to the base.

7. The sensor package of claim 1, further comprising die attachment material mechanically coupling the first sensor die to the second sensor die.

8. The sensor package of claim 1, wherein the first active sensor circuit and the second active sensor circuit comprise magnetic sensors or inertial sensors.

9. A method for fabricating a directional sensor, the method comprising:

forming a groove in a wafer using a selective etch process;

depositing metal pads on an angled surface within the groove and depositing a first active sensor circuit on a surface outside of the groove, wherein the first active sensor circuit is electrically coupled to the metal pads;

singulating the wafer to obtain an individual sensor die;

vertically mounting the sensor die onto a base such that the first active sensor circuit is vertical to the base and the metal pads are positioned on the sensor die opposite from the base;

interconnecting the active sensor circuit to another circuit by installing wirebonds onto the metal pads.

10. The method of claim 9, further comprising:

mounting a second sensor die having a second active sensor circuit to the base such that the second active sensor circuit is oriented orthogonal with respect to the first active sensor circuit.

11. The method of claim 10, further comprising:

wirebonding an electrical connection between the metal pads and the second active sensor circuit of the second sensor die.

12. The method of claim 10, wherein the first active sensor circuit comprises a two-axis sensor;

and

wherein the second active sensor circuit comprises a one-axis sensor oriented orthogonally to at least one axis of the two-axis horizontal sensor.

13. The method of claim 10, wherein second active sensor circuit comprises a two-axis sensor;

and

wherein the first active sensor circuit comprises a one-axis sensor oriented orthogonally to at least one axis of the two-axis sensor.

14. The method of claim 10, further comprising mechanically coupling the first sensor die to the second sensor die using a die attachment material.

15. The method of claim 9, further comprising mechanically coupling the first sensor die to the base using a die attachment material.

16. The method of claim 9, further comprising:

wirebonding an electrical connection from the metal pads to the base.

17. The method of claim 9, wherein the first active sensor circuit comprise either a magnetic sensor or an inertial sensor.

18. A vertical sensor die for use in a three-axis sensor package, the vertical sensor die comprising:

an active sensor circuit located on a first surface; and

a plurality of metal pads electrically coupled to the active sensor located on a second surface;

wherein the second surface is adjacent to the first surface and angled with respect to a plane of the first surface.

19. The vertical sensor die of claim 18, wherein the first active sensor circuit comprises either a single-axis sensor or a two-axis sensor.

20. The vertical sensor die of claim 18, wherein the second surface is angled inward from the plane of the first surface at least 45 degrees.