Printing nozzle arrangement having fault detector

• US 8,317,301 B2
• Filed: 10/03/2011
• Issued: 11/27/2012
• Est. Priority Date: 06/30/1999
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Zamtec Limited (Memjet Limited)
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Nguyen, Lam S
• Application Number:
  US13/252,187
• Publication Number:
  US 20120019602A1
• Time in Patent Office: 421 Days
• Field of Search: 347/5, 347/9, 347/19, 347/55, 347/56, 347/65
• US Class Current: 347/65
• CPC Class Codes: B41J 2/04508 aiming at correcting other parameters
• CPC Class Codes: B41J 2/0451 for detecting failure, e.g. clogging, malfunctioning actuator
• CPC Class Codes: B41J 2/04541 Specific driving circuit
• CPC Class Codes: B41J 2/04585 controlling heads based on thermal bent actuators
• CPC Class Codes: B41J 2/04588 using a specific waveform
• CPC Class Codes: B41J 2/0459 Height of the driving signal being adjusted
• CPC Class Codes: B41J 2/04591 Width of the driving signal being adjusted
• CPC Class Codes: B41J 2/04596 Non-ejecting pulses
• CPC Class Codes: B41J 2/125 Sensors, e.g. deflection sensors nozzle clogging detection for cleaning reasons B41J2/16579; detection for compensation for failed nozzles B41J2/2139
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2002/14346 Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling
• CPC Class Codes: B41J 2002/14354 Sensor in each pressure chamber
• CPC Class Codes: B41J 2002/14435 Moving nozzle made of thermal bend detached actuator
• CPC Class Codes: B41J 29/38 Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
• CPC Class Codes: B41J 29/393 Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns
• CPC Class Codes: Y10T 137/8225 Position or extent of motion indicator
• CPC Class Codes: Y10T 137/8242 Electrical

Abstract

A printing nozzle arrangement is provided having an electrical current source, a fluid chamber having a fluid inlet and fluid ejection port, a heating element within the chamber electrically connected to the electrical current source, and a microprocessor. The heating element is configured such that electrical current applied by the electrical current source at a predetermined energy level causes resistive heating and ejection of the fluid from the fluid ejection port. The microprocessor is configured to test for faulty operation of the heating element by causing application of electrical current for a predetermined duration which does not result in fluid ejection. When faulty operation is determined, the microprocessor is configured to cause application of electrical current at an energy level significantly greater than the predetermined energy level in an attempt to clear fluid blockages associated with the chamber.

Claims

1. A printing nozzle arrangement comprising:

an electrical current source;

a fluid chamber having a fluid inlet and fluid ejection port;

a heating element electrically connected to the electrical current source, the heating element being configured such that electrical current applied by the electrical current source at a predetermined energy level causes resistive heating and ejection of the fluid from the fluid ejection port; and

a microprocessor configured to test for faulty operation of the heating element by causing application of electrical current for a predetermined duration which does not result in fluid ejection,

wherein, when faulty operation is determined, the microprocessor is configured to cause application of electrical current at an energy level significantly greater than the predetermined energy level in an attempt to clear fluid blockages associated with the chamber;

wherein the electrical current source is incorporated in CMOS layers of a substrate on which the fluid chamber and an open space are defined, and

wherein the heating element comprises a portion movable within the fluid chamber and another portion movable within the open space.

2. A nozzle arrangement according to claim 1, wherein the substrate is a silicon substrate and the CMOS layers include a metal oxide semiconductor layer, a passivation layer and a non-corrosive dielectric coating/chamber-defining layer defined on the silicon substrate.

3. A nozzle arrangement according to claim 2, wherein the heating element is incorporated in a titanium-aluminum-nitride deposit on the substrate.

4. A nozzle arrangement according to claim 1, wherein the noncorrosive dielectric coating/chamber-defining layer defines and separates the fluid chamber and the open space.