Adhesive composition

• US 8,319,222 B2
• Filed: 07/22/2011
• Issued: 11/27/2012
• Est. Priority Date: 06/12/2007
• Status: Active Grant

• Current Assignee: Sony Chemical & Information Device Corporation (Sony Group Corp.)
• Original Assignee: Sony Chemical & Information Device Corporation (Sony Group Corp.)
• Inventors: Akutsu, Yasushi, Yamada, Yasunobu, Miyauchi, Kouichi
• Primary Examiner(s): Douyon, Lorna M
• Assistant Examiner(s): Nguyen, Tri V
• Application Number:
  US13/137,141
• Publication Number:
  US 20110281119A1
• Time in Patent Office: 494 Days
• Field of Search: 428355 BL-4238, 428/355.R, 428/356, 428/423.1, 156325-331, 257/59, 257/753, 257/783, 257/786, 252/500, 252/511, 174/259
• US Class Current: 257/59
• CPC Class Codes: C08F 290/06 Polymers provided for in subclass C08G
• CPC Class Codes: C08F 290/061 Polyesters; Polycarbonates
• CPC Class Codes: C08F 290/065 Polyamides; Polyesteramides; Polyimides
• CPC Class Codes: C08G 18/8116 esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
• CPC Class Codes: C09J 133/14 of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
• CPC Class Codes: C09J 175/06 from polyesters
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 2202/28 Adhesive materials or arrangements
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13599 Material
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29599 Material
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 : Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: Y10S 428/901 : Printed circuit
• CPC Class Codes: Y10T 428/2852 : Adhesive compositions
• CPC Class Codes: Y10T 428/2857 : including metal or compound thereof or natural rubber
• CPC Class Codes: Y10T 428/2883 : including addition polymer of diene monomer [e.g., SBR, SIS, etc.]
• CPC Class Codes: Y10T 428/2887 : including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
• CPC Class Codes: Y10T 428/2896 : including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
• CPC Class Codes: Y10T 428/31551 : Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Abstract

A connection structure comprising an adhesive composition is provided. The adhesive composition is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1):
CH₂═CR₀—COO—R₁—NHCOO—R₂  (1)
wherein R₀ is a hydrogen atom or a methyl group, R₁ is a divalent hydrocarbon group, and R₂ is an optionally substituted lower alkyl group.

Claims

1. An anisotropic conductive connection structure comprising:

mutually facing electrodes; and

an adhesive composition interposed between the electrodes, the electrodes being electrically connected through the adhesive composition,

wherein the adhesive composition comprises a thermoplastic resin, a polyfunctional acrylate, a conductive particle for anisotropic conductive connection, and a radical polymerization initiator, wherein the adhesive composition further comprises a monofunctional urethane acrylate having a urethane residue at a terminal end, the monofunctional urethane acrylate being represented by the formula (1);

CH₂═

CR₀—

COO—

R₁—

NHCOO—

R₂ 

 

(1)

wherein R₀ is a hydrogen atom or a methyl group, R₁ is a divalent hydrocarbon group, and R₂ is an optionally substituted methyl, ethyl, isopropyl, propyl, butyl, isobutyl, pentyl, hexyl or cyclohexyl group.

2. The connection structure according to claim 1, wherein one of the mutually-facing electrodes is an electrode pad of a semiconductor device.

3. The connection structure according to claim 1, wherein the monofunctional urethane acrylate of the adhesive composition is contained in an amount of 2 to 20 percent by mass with respect to the total mass of the thermoplastic resin, the polyfunctional acrylate, the radical polymerization initiator, and the monofunctional urethane acrylate.

4. A connection structure according to claim 1, wherein R₁ of formula (1) is an alkylene group.

5. A connection structure according to claim 4, wherein the alkylene group is an ethylene group.

6. A connection structure according to claim 1, wherein R₂ of formula (1) is a methyl group, an ethyl group, an ethoxyethyl group, a butyl group, or a hexyl group.

7. A connection structure according to claim 6, wherein R₂ is a methyl group or an ethyl group.