Trench MOS barrier schottky rectifier with a planar surface using CMP techniques
First Claim
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1. A semiconductor device, comprising:
- an epitaxial layer;
a silicide layer disposed on at least a portion of the epitaxial layer;
a field oxide extending into the epitaxial layer;
a substantially planar surface including a substantially planar region of the field oxide and a substantially planar region of the epitaxial layer, the substantially planar surface being in contact with a substantially planar bottom surface of the silicide layer;
a trench disposed in the epitaxial layer, the trench having a trench sidewall and a bottom;
a shield dielectric lining the trench sidewall and the bottom of the trench, the shield dielectric being disposed on at least a portion of the field oxide; and
a polysilicon disposed in the trench.
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Abstract
High Efficiency Diode (HED) rectifiers with improved performance including reduced reverse leakage current, reliable solderability properties, and higher manufacturing yields are fabricated by minimizing topography variation at various stages of fabrication. Variations in the topography are minimized by using a CMP process to planarize the HED rectifier after the field oxide, polysilicon and/or solderable top metal are formed.
377 Citations
19 Claims
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1. A semiconductor device, comprising:
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an epitaxial layer; a silicide layer disposed on at least a portion of the epitaxial layer; a field oxide extending into the epitaxial layer; a substantially planar surface including a substantially planar region of the field oxide and a substantially planar region of the epitaxial layer, the substantially planar surface being in contact with a substantially planar bottom surface of the silicide layer; a trench disposed in the epitaxial layer, the trench having a trench sidewall and a bottom; a shield dielectric lining the trench sidewall and the bottom of the trench, the shield dielectric being disposed on at least a portion of the field oxide; and a polysilicon disposed in the trench. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor device, comprising:
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an epitaxial layer; a silicide layer disposed on at least a portion of the epitaxial layer; a field oxide extending into the epitaxial layer; a trench disposed in the epitaxial layer and below the silicide layer; a top metal having a first portion disposed above the field oxide and a second portion disposed on at least a portion of the silicide layer; a dielectric layer; a solderable top metal (STM) layer adjacent to the dielectric layer; and a substantially planar surface including a substantially planar region of the dielectric layer disposed on the first portion of the top metal, a substantially planar first region of the STM layer disposed on the first portion of the top metal, and a substantially planar second region of the STM layer disposed on the second portion of the top metal. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification