Method of producing an isolator for a microelectromechanical system (MEMS) die
First Claim
1. A method of producing an isolator for a microelectromechanical system (MEMS) die, comprising:
- etching a single layer comprising a central region and a plurality of substantially radial isolation beams, each extending from the central region to a separate radial symmetric pad;
bonding a vacuum package to the central region of the single layer at a bottom side of the single layer; and
bonding a MEMS die comprising a baseplate supporting a MEMS device to each separate radial symmetric pad at a periphery of the baseplate of the MEMS die at a top side of the single layer.
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Accused Products
Abstract
A single layer micromachined thermal and mechanical isolator may be bonded between a microelectromechanical system (MEMS) die and package. Small bond pads of the isolator are attached to the periphery of the die. The isolator material may be chosen to match that of the die, reducing CTE mismatch. Long thin isolation beams can be used to provide thermal isolation against external temperature changes, which may be conducted through the package. Weak and flexible beams can be used to tolerate large displacements with very little resistance. Thus, excessive stress or distortion to the package, from either CTE mismatch or external stress, may be absorbed by the isolator and will not be transmitted to the MEMS die. Beam rigidity may be designed to attenuate vibration of particular frequency range. The isolator can be readily inserted into an existing disc resonator gyroscope package in one thermal compression bond step.
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Citations
10 Claims
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1. A method of producing an isolator for a microelectromechanical system (MEMS) die, comprising:
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etching a single layer comprising a central region and a plurality of substantially radial isolation beams, each extending from the central region to a separate radial symmetric pad; bonding a vacuum package to the central region of the single layer at a bottom side of the single layer; and bonding a MEMS die comprising a baseplate supporting a MEMS device to each separate radial symmetric pad at a periphery of the baseplate of the MEMS die at a top side of the single layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification