Integrated circuit with embedded RFID
First Claim
1. An integrated circuit (IC) die comprising:
- a high capacitance solid state circuit region configured to perform predetermined operations;
a RFID block comprising a FeRAM block for storing data;
an interface unit configured to transfer to the RFID block an externally-provided unique ID for wirelessly identifying the IC die, the interface unit being further configured to enable communication between the RFID block and the high capacitance solid state circuit region, the RFID block being further configured to generate an internal BIST (built-in self test) command in response to an external command received by the RFID block directly through the high capacitance solid state circuit region; and
a conductive trace extending through predetermined regions of the IC die, the conductive trace being configured as an antenna for the RFID block, wherein the RFID block is configured to receive and transmit information to an external source via the antenna;
wherein the FeRAM block stores the unique ID, at least part of test results performed in the IC die, and tracking information in the IC die, the tracking information identifying manufacturing plant in which the IC die is manufactured and process technology used to manufacture the IC die.
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Accused Products
Abstract
An integrated circuit (IC) die includes a high capacitance solid state circuit region configured to perform predetermined operations and an RFID block configured for wireless communication with an external source. The RFID block is configured to record results from a plurality of stages of a manufacturing process. The RFID block is further configured to generate an internal BIST command in response to an external command wirelessly received by the RFID. The integrated circuit die also includes a built-in self-test (BIST) block coupled to carry out testing of the high capacitance solid state circuit region in response to the internal BIST command. The RFID block is configured to be capable of storing store information relating to the testing. The RFID block is further configured to enable wireless retrieval of the test results from the testing of the high capacitance solid state circuit region.
37 Citations
21 Claims
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1. An integrated circuit (IC) die comprising:
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a high capacitance solid state circuit region configured to perform predetermined operations; a RFID block comprising a FeRAM block for storing data; an interface unit configured to transfer to the RFID block an externally-provided unique ID for wirelessly identifying the IC die, the interface unit being further configured to enable communication between the RFID block and the high capacitance solid state circuit region, the RFID block being further configured to generate an internal BIST (built-in self test) command in response to an external command received by the RFID block directly through the high capacitance solid state circuit region; and a conductive trace extending through predetermined regions of the IC die, the conductive trace being configured as an antenna for the RFID block, wherein the RFID block is configured to receive and transmit information to an external source via the antenna; wherein the FeRAM block stores the unique ID, at least part of test results performed in the IC die, and tracking information in the IC die, the tracking information identifying manufacturing plant in which the IC die is manufactured and process technology used to manufacture the IC die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for increasing use efficiency of packaged IC dies each including a RFID block and an antenna to enable wireless communication with the IC die, the method comprising:
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prior to packaging the IC dies, storing a unique identification code in each of the IC dies; generating an internal BIST (built-in self test) command in response to an external command received by the RFID block wirelessly and directly through a high capacitance solid state circuit region; testing each IC die; storing at least part of the test results from the testing step in the corresponding IC die; and storing tracking information in each IC die, the tracking information identifying one or more of;
manufacturing plant in which the IC die is manufactured, process technology used to manufacture the IC die, type of package in which the IC die is housed, and packaging plant in which the IC die is packaged;wherein the unique identification code stored in each IC die together with the RFID block and the antenna of each IC die enable wireless disabling of a defective portion of a packaged IC die so that a remaining functional portion of the packaged IC die can be used. - View Dependent Claims (18, 19, 20, 21)
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Specification