Advanced smart cards with integrated electronics in bottom layer and method of making such advanced smart cards

• US 8,324,021 B2
• Filed: 11/09/2010
• Issued: 12/04/2012
• Est. Priority Date: 03/23/2005
• Status: Expired due to Fees

• Current Assignee: Paul Reed
• Original Assignee: Paul Reed
• Inventors: Reed, Paul
• Primary Examiner(s): Blum, David S
• Application Number:
  US12/942,706
• Publication Number:
  US 20110155809A1
• Time in Patent Office: 756 Days
• Field of Search: 438/106, 235/488, 298/41
• US Class Current: 438/106
• CPC Class Codes: B29C 2045/14532 injecting between two sheets
• CPC Class Codes: B29C 45/1418 the inserts being deformed or preformed, e.g. by the injection pressure
• CPC Class Codes: B29C 45/14467 Joining articles or parts of a single article B29C45/14377, B29C45/14385, B29C45/14581, B29C45/14614 and B29C45/006 take precedence
• CPC Class Codes: B29C 45/14647 Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
• CPC Class Codes: B29C 45/34 having venting means
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07724 the record carrier being at least partially made by a molding process molding in general B29C45/14
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49172 by molding of insulating material

Abstract

An advanced smart card with a top layer, a core layer of thermoset polymeric material, and a bottom layer comprising an integrated electronics assembly mounted on a substrate. The advanced smart card is formed by positioning a bottom layer in a bottom mold, placing a top layer in a top mold, closing the mold, injecting a thermosetting polymeric material to form a precursor advanced smart card, removing the precursor, and trimming the precursor to produce a finished smart card.

Claims

1. An advanced smart card comprising a top layer, a core layer of thermoset polymeric material, and a bottom layer comprising an integrated electronics assembly mounted on a substrate formed according to the following steps:

(1) positioning a bottom layer comprising the integrated electronics assembly mounted on a substrate in a bottom mold;

(2) positioning a top layer comprising synthetic paper or other plastic material in a top mold;

(3) closing the top mold to the bottom mold in a manner that creates a void space between the top layer and the bottom layer comprising the integrated electronics assembly;

(4) injecting a thermosetting polymeric material into the void space to form a core layer consisting of polymeric material, the injection taking place at a temperature and pressure which are such that;

(a) the top layer of material is at least partially cold, low pressure molded into a cavity in the top mold;

(b) gases and excess polymeric material are driven out of the void space;

(c) the injected polymeric material flows over and around all exposed portions of the electronic components of the integrated electronic assembly positioned on the top surface of the bottom layer such that the bottom surface of the bottom layer remains free of the injected polymeric material and;

(d) the thermosetting polymeric material bonds with both the top layer and the bottom layer to produce a unified precursor advanced smart card body;

(5) removing the unified precursor advanced smart card body from the top and bottom molds; and

(6) trimming the precursor advanced smart card to a desired dimension to produce a finished advanced smart card.

2. The advanced smart card of claim 1, wherein the integrated electronics assembly mounted on a substrate has maximum dimensions of 54 mm high, 85.6 mm long, and 0.50 mm thick.

3. The advanced smart card of claim 1, wherein the substrate is a printed circuit board.

4. The advanced smart card of claim 1 wherein the inside surface of the top layer and the inside surface of the bottom layer are treated to facilitate the creation of a strong bond between the top layer and the thermosetting material and the bottom layer and the thermosetting material.

5. The advanced smart card of claim 1 wherein the inside surface of the top layer and the inside surface of the bottom layer are treated by coating each with a bond promoting agent.

6. The advanced smart card of claim 1 wherein the inside surface of the top layer and the inside surface of the bottom layer are treated by a corona discharge process.

7. The advanced smart card of claim 1 wherein the thermosetting polymeric material is injected into the void space at a pressure less than 100 psi.

8. The advanced smart card of claim 1 wherein the thermosetting polymeric material is injected into the void space at a temperature less than 100°

F.

9. The advanced smart card of claim 1 wherein the integrated electronics assembly includes electronic components selected from the following group:

microprocessors, antennae, Integrated Circuit (IC) chips, batteries, Light Emitting Diodes (LED), Liquid Crystal Displays (LCD), polymer dome switches, acoustic speakers, and sensors (such as fingerprint sensors).

10. The advanced smart card of claim 1 wherein the top layer is formed from a flat sheet of polymeric material.

11. The advanced smart card of claim 1 wherein the top layer is preformed with at least one card-forming cavity.

12. The advanced smart card of claim 1 wherein the top layer is molded into an advanced smart card forming cavity of a top mold and the bottom layer is molded against a substantially flat surface of a bottom mold.

13. The advanced smart card according to claim 1 wherein an outside surface of the substrate upon which the electronics assembly is mounted forms an outer surface of the advanced smart card.

14. An advanced smart card comprising a top layer, a core layer of thermoset polymeric material, and a bottom layer comprising an integrated electronics assembly mounted on a substrate formed according to the following steps:

(1) using an integrated electronics assembly mounted on a substrate, with maximum dimensions of 54 mm wide, 85.6 mm long, and 0.50 mm thick, and positioning the integrated electronics assembly mounted on a substrate in a bottom mold;

(2) positioning a top layer comprising synthetic paper or other plastic material in a top mold;

(3) closing the top mold to the bottom mold in a manner that creates a void space between the top layer and the bottom layer comprising the integrated electronics assembly;

(4) injecting a thermosetting polymeric material into the void space to form a core layer consisting of polymeric material, the injection taking place at a temperature less than 150°

F. and pressure less than 100 PSI which are such that;

(a) the top layer of material is at least partially cold, low pressure molded into a cavity in the top mold;

(b) gases and excess polymeric material are driven out of the void space;

(c) the injected polymeric material flows over and around all exposed portions of the electronics components of the integrated electronics assembly positioned on the top surface of the bottom layer such that the bottom surface of the bottom layer remains free of the injected polymeric material; and

(d) the thermosetting polymeric material bonds with both the top layer and the bottom layer to produce a unified precursor advanced smart card body;

(5) removing the unified precursor advanced smart card body from the top and bottom molds; and

(6) trimming the precursor advanced smart card to a desired dimension to produce a finished advanced smart card.

15. The advanced smart card according to claim 14 wherein an outside surface of the substrate upon which the electronics assembly is mounted forms an outer surface of the advanced smart card.