High-temperature polyamide molding compounds reinforced with flat glass fibers

• US 8,324,307 B2
• Filed: 08/25/2008
• Issued: 12/04/2012
• Est. Priority Date: 08/24/2007
• Status: Active Grant

• Current Assignee: EMS-Patent AG (Emesta Holding AG)
• Original Assignee: EMS-Patent AG (Emesta Holding AG)
• Inventors: Harder, Philipp, Jeltsch, Thomas, Lamberts, Nikolai
• Primary Examiner(s): Choi, Ling
• Assistant Examiner(s): LACLAIR LYNX, DARCY DANIELLE
• Application Number:
  US12/198,002
• Publication Number:
  US 20090062452A1
• Time in Patent Office: 1,562 Days
• Field of Search: 524/414, 524/494, 524/495, 524/496, 524/514, 524/847
• US Class Current: 524/494
• CPC Class Codes: C08G 69/26 derived from polyamines and polycarboxylic acids
• CPC Class Codes: C08G 69/265 from at least two different diamines or at least two different dicarboxylic acids
• CPC Class Codes: C08G 69/36 derived from amino acids, polyamines and polycarboxylic acids
• CPC Class Codes: C08K 2201/016 Additives defined by their aspect ratio
• CPC Class Codes: C08K 7/14 Glass
• CPC Class Codes: C08L 2205/16 Fibres; Fibrils
• CPC Class Codes: C08L 77/06 Polyamides derived from polyamines and polycarboxylic acids C08L77/10 takes precedence

Abstract

The present invention relates to reinforced polyamide molding compounds containing high-melting partially aromatic polyamides and flat glass fibers, in particular with a rectangular cross section, i.e., glass fibers with a noncircular cross-sectional area and a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis of 2 to 6, in particular 3 to 6, most especially preferably from 3.5 to 5.0. The present invention also relates to a method for manufacturing polyamide molding compounds and molded articles manufactured therefrom, i.e., in particular injection-molded parts. The inventive molded parts have a high transverse stiffness and transverse strength.

Claims

1. A reinforced polyamide molding compound having a high notched impact strength, consisting of:

(A) 20 to 60 wt % of at least one partially aromatic polyamide with a DSC melting point (ISO

     11357) of at least 270°

C., having a solution viscosity, measured in m-cresol (0.5 wt %, 20°

C.) of η

_rel less than 1.9,

the one or more polyamides selected from the group consisting of;

polyamide 6T/6I, which contains 50 to 80 mol % hexamethyleneterephthalamide units and 20 to 50 mol hexamethyleneisophthalamide units;

polyamide 6T/66 which contains 50 to 80 mol % hexamethyleneterephthalamide units and 20 mol % to 50 mol % hexamethyleneadipamide (66) units;

ternary polyamide 6T/6I/66 containing 50 mol % to 70 mol % hexamethyleneterephthalamide units, 5 mol % to 45 mol % hexamethyleneisophthalamide units and 5 mol % to 45 mol % hexamethyleneadipamide (66) units;

and mixtures, blends or alloys thereof;

(B) 40 to 80 wt % of at least one filler consisting of;

(B1) 20 to 80 wt % flat glass fibers with an elongated shape, where the glass fibers have a noncircular cross-sectional area and a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis of 2 to 6,

(B2) 0-30 wt % particulate or stratified fillers,

(B3) 0-30 wt % boron fibers and/or basalt fibers and/or aramid fibers (p- or m-aramid fibers),

(B4) 0 to 30 wt % glass fibers with a round cross section,

wherein the weight percent of each type of filler (B1)-(B4) is based on the entire molding compound; and

(C) 0 to 20 wt % of additives and auxiliary substances, not including carbon fiber,

wherein the amount of components (A) through (C) in wt % yields 100% together.

2. The polyamide molding compound according to claim 1, wherein no glass fibers with an elongated or oval shape or curved shape with at least one constricted section are present.

3. The polyamide molding compound according to claim 1, wherein glass fibers with a rectangular or almost rectangular cross section are used as the flat glass fibers.

4. The polyamide molding compound according to claim 1, having a high deflection temperature HDTA (1.8 MPa) of at least 260°

C.

5. The polyamide molding compound according to claim 1, wherein the flat glass fibers are in the form of short glass (chopped glass) with a length of 2 to 50 mm.

6. The polyamide molding compound according to claim 1, wherein the flat glass fibers are in the form of long glass (rovings).

7. The polyamide molding compound according to claim 1, wherein the flat glass fibers are present in the molding compound in concentrations between 48 and 75 wt % based on the total weight of the molding compound.

8. The polyamide molding compound according to claim 1, wherein the flat glass fibers have a diameter of the main cross-sectional axis of 6 to 40 μ

m and have a diameter of the secondary cross-sectional axis of 3 to 20 μ

m, whereby the ratio of the cross-sectional axes perpendicular to each other is in the range of 3 to 6.

9. The polyamide molding compound according to claim 1, wherein the flat glass fibers are selected from the group consisting of E-glass fibers, A-glass fibers, C-glass fibers, D-glass fibers, M-glass fibers, S-glass fibers or R-glass fibers or mixtures thereof.

10. The polyamide molding compound according to claim 1, wherein the one or more polyamides is a polyamide 6T/6I or a polyamide 6T/66 containing at least 52 mol % hexamethylene-terephthalamide units.

11. The polyamide molding compound according to claim 1, wherein the molding compound has notched impact strength of at least 23 kJ/m² (measured according to Charpy at 23°

C. according to ISO 179/2-1 eA) with a glass fiber content of ≧

60 wt %, or a notched impact strength of more than 20 kJ/m² (measured according to Charpy at 23°

C. according to ISO 179/2-1 eA) at a glass fiber content of 50 to 60 wt %.

12. The polyamide molding compound according to claim 1, having a high flow length >

120 mm, with degrees of reinforcement with component (B) in the range of 40 wt % to 65 wt %.

13. The polyamide molding compound according to claim 1, wherein at least one of the additives and auxiliary substances (C) in the molding compound, is selected from the group consisting of inorganic stabilizers, organic stabilizers, lubricants, dyes, metallic pigments, metal flakes, metal-coated particles, halogenated flame retardants, halogen-free flame retardants, antistatics, conductivity additives, mold release aids, optical brighteners, natural phyllosilicates, synthetic phyllosilicates or mixtures of the aforementioned additives.

14. The polyamide molding compound according to claim 13, wherein the flame retardants are a phosphinate compound contained in an amount of 5 wt % to 20 wt % and a polyphosphate salt are of a 1,3,5-triazine compound contained in an amount of 0.2 wt % to 10 wt %.

15. The polyamide molding compound according to claim 13, wherein at least one of the additives and auxiliary substances (C) in the molding compound is a phosphinate compound as a halogen free flame retardant contained in an amount of 5 wt % to 20 wt %.

16. The polyamide molding compound according to claim 13, wherein the conductivity additives are selected from carbon black and carbon nanotubes.

17. The polyamide molding compound according to claim 13, wherein the flame retardants are a phosphinate compound contained in an amount of 8 wt % to 17.8 wt % and a polyphosphate salt of a 1,3,5-triazine compound contained in an amount of 0.2 wt % to 1.0 wt %.

18. A method for manufacturing the polyamide molding compound according to claim 1, on conventional compounding equipment at set barrel temperatures of 280°

C. to 350°

C., whereby the polymer component is first melted and then the chopped flat glass fibers and/or the other fillers are added.

19. In a method of injection molding, molding a molding compound according to claim 1 to produce a molded article or part of a molded article, wherein said molding compound has a notched impact strength of more than 20 kJ/m² (measured according to Charpy at 23°

C., according to ISO 179/2-1 eA).

20. The method of claim 19, wherein said molding is carried out by injection molding, extrusion, pultrusion or blow molding.

21. A molded body, an injection-molded part, formed from the molding compound of claim 1.

22. The molded body according to claim 21 in the form of a cellular telephone casing or cellular telephone housing part.

23. The polyamide molding compound according to claim 1, wherein the component (B1) isto 80 wt %, flat glass fibers with an elongated shape, where the glass fibers have a noncircular cross-sectional area and a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis of 2 to 6.

24. The polyamide molding compound according to claim 1, wherein the flat glass fibers with an elongated shape have a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis of 3 to 6.

25. The polyamide molding compound according to claim 1, wherein the flat glass fibers with an elongated shape have a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis of 3.5 to 5.0.

26. The polyamide molding compound according to claim 1, wherein the flat glass fibers have a diameter of the main cross-sectional axis of 6 to 40 μ

m and have a diameter of the secondary cross-sectional axis of 3 to 20 μ

m, whereby the ratio of the cross-sectional axes perpendicular to each other is in the range of 3.5 and 5.0.

27. The polyamide molding compound according to claim 1, wherein the flat glass fibers are selected from the group consisting of E-glass fibers, A-glass fibers, C-glass fibers, D-glass fibers, M-glass fibers, S-glass fibers or R-glass fibers or mixtures thereof, only E- and S-glass fibers, and whereby the fibers are provided with an amino or epoxysilane coating.

28. The polyamide molding compound according to claim 1, wherein the one or more polyamides has a solution viscosity, measured in m-cresol (0.5 wt %, 20°

C.), of η

_rel less than 1.8.

29. The polyamide molding compound according to claim 1, wherein the one or more polyamides is selected from the group consisting of:

polyamide 6T/6I, which contains 62 to 73 mol % hexamethyleneterephthalamide units and 25 to 38 mol % hexamethyleneisophthalamide units;

polyamide 6T/66 which contains 52 to 62 mol % hexamethyleneterephthalamide units and 38 mol % to 48 mol % hexamethyleneadipamide (66) units;

and mixtures, blends or alloys thereof.