Chip coated light emitting diode package and manufacturing method thereof

• US 8,324,646 B2
• Filed: 07/23/2010
• Issued: 12/04/2012
• Est. Priority Date: 01/10/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Seon Goo, Han, Kyung Taeg, Han, Seong Yeon
• Primary Examiner(s): Richards, N Drew
• Assistant Examiner(s): DIALLO, MAMADOU L
• Application Number:
  US12/842,493
• Publication Number:
  US 20100289051A1
• Time in Patent Office: 865 Days
• Field of Search: 257/81, 257/82, 257/91, 257/98, 257/99, 257/100, 257/116, 257/117, 257432-437, 257/749, 257E33056-E33059, 257/E25.032
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

Claims

1. A chip coated Light Emitting Diode (LED) package comprising:

a light emitting chip including a submount a light emitting source attached to the submount and a resin layer covering an outer surface of the light emitting source;

at least one bump ball provided on the light emitting source and exposed through an upper surface of the resin layer, the at least one bump ball having an upper surface that is substantially coplanar with the upper surface of the resin layer; and

a package body having an electrode part and the light emitting chip mounted thereon; and

a metal wire connecting the at least one bump ball with the electrode part.

2. The chip coated LED package according to claim 1, wherein the resin layer contains a fluorescent material for converting the wavelength of light generated from the light emitting source.

3. The chip coated LED package according to claim 1, wherein the electrode part comprises a lead frame integrally provided to the package body.

4. The chip coated LED package according to claim 1, wherein the package body comprises a resin structure which is injection molded with resin to have a cavity formed therein, and wherein the light emitting chip is mounted on the cavity.

5. The chip coated LED package according to claim 1, wherein the cavity comprises a reflecting part disposed on an inner surface of the cavity for reflecting the light generated from the light emitting source.

6. The chip coated LED package according to claim 1, wherein the cavity comprises a filler made of transparent resin filled therein and the package body further comprises a lens provided on an upper part thereof.

7. The chip coated LED package according to claim 1, wherein the package body has a disposition hole formed therein, the disposition hole exposing a metallic chassis with the light emitting chip mounted thereon, and the package body comprises a substrate having the electrode part pattern-printed on an upper surface thereof.

8. The chip coated LED package according to claim 7, wherein the disposition hole comprises a reflecting part disposed on an inner surface of the disposition hole for reflecting the light generated from the light emitting source.

9. The chip coated LED package according to claim 8, wherein the disposition hole comprises a filler made of transparent resin filled therein and the package body further comprises a lens provided on an upper part thereof.

10. The chip coated LED package according to claim 1, wherein the light emitting source has side surfaces and an entire area of the side surfaces is covered with the resin layer.

11. The chip coated LED package according to claim 1, where the side surfaces of the resin layer are substantially coplanar with the side surfaces of the submount, respectively.

12. A light emitting chip including:

a submount;

a light emitting source attached to the submount;

a resin layer covering an outer surface of the light emitting source; and

at least one bump ball provided on the light emitting source for electrical connection to an external current source and exposed through an upper surface of the resin layer, the at least one bump ball having an upper surface that is substantially coplanar with the upper surface of the resin layer.

13. An illumination device comprising:

a package body having an electrode part; and

a light emitting chip mounted on the package body, the light emitting chip including;

a submount;

a light emitting source attached to the submount;

a resin layer covering an upper surface of the light emitting source; and

at least one bump ball provided on the light emitting source and exposed through an upper surface of the resin layer, the bump ball having an upper surface being substantially coplanar with an upper surface of the resin layer,

wherein a first electrode is disposed on the upper surface of the light emitting source and a second electrode is disposed on a lower surface of the light emitting source, wherein an entire portion of the resin layer under which the light emitting source is disposed has a substantially uniform vertical thickness, and wherein the at least one bump ball is connected to the first electrode and the electrode part is electrically connected to the at least one bump ball.

14. The illumination device according to claim 13, wherein the resin layer contains a fluorescent material for converting the wavelength of light generated from the light emitting source.

15. The illumination device according to claim 13, wherein the at least one bump ball have a substantially uniform vertical thickness.

16. The illumination device according to claim 13, wherein the resin layer contacts directly a portion of the upper surface of the light emitting source other than an area of the upper surface of the light emitting source on which the bump ball is disposed.

17. The illumination device according to claim 13, wherein the electrode part comprises a lead frame integrally provided to the package body.

18. The illumination device according to claim 13, wherein the package body comprises a resin structure which is injection molded with resin to have a cavity formed therein, and the light emitting chip is mounted on the cavity.

19. The illumination device according to claim 18, wherein the cavity comprises a reflecting part formed on an inner surface of the cavity for reflecting the light generated from the light emitting source.

20. The illumination device according to claim 18, wherein the cavity comprises a filler made of transparent resin filled therein and the package body further comprises a lens provided on an upper part thereof.

21. The illumination device according to claim 13, wherein the package body comprises a substrate having the electrode part pattern-printed on an upper surface thereof.

22. An illumination device comprising:

a package body having an electrode part; and

a light emitting chip mounted on the package body, the light emitting chip including;

a submount;

a light emitting source attached to the submount;

a resin layer covering an upper surface of the light emitting source; and

at least one bump ball provided on the light emitting source and exposed through an upper surface of the resin layer, wherein a first electrode is disposed on the upper surface of the light emitting source and a second electrode disposed on a lower surface of the light emitting source,

wherein an entire portion of the resin layer under which the light emitting source is disposed has a substantially uniform vertical thickness,

wherein the at least one bump ball are connected to the first electrode and the electrode part is electrically connected to the at least one bump ball, and

wherein the package body has a disposition hole formed therein, the disposition hole exposing a metallic chassis with the light emitting chip mounted thereon, and the package body comprises a substrate having the electrode part that is pattern printed on an upper surface of the substrate.

23. The illumination device according to claim 22, wherein the disposition hole comprises a reflecting part formed on an inner surface thereof for reflecting the light generated from the light emitting source.

24. An illumination device comprising:

a package body having an electrode part; and

a light emitting chip mounted on the package body, the light emitting chip including;

a submount;

a light emitting source attached to the submount;

a resin layer covering an upper surface of the light emitting source; and

at least one bump ball provided on the light emitting source and exposed through an upper surface of the resin layer, the bump ball having an upper surface substantially coplanar with an upper surface of the resin layer,

wherein the resin layer directly contacts a portion of the upper surface of the light emitting source other than an area of the upper surface of the light emitting source on which the bump ball is disposed,

wherein the electrode part is electrically connected to the at least one bump ball.

25. An illumination device comprising:

a package body having an electrode part; and

a light emitting chip mounted on the package body, the light emitting chip including;

a submount;

a light emitting source attached to the submount;

a resin layer covering an upper surface of the chip die; and

at least one bump ball provided on the light emitting source and exposed through an upper surface of the resin layer, the bump ball having an upper surface substantially coplanar with an upper surface of the resin layer, wherein an entire portion of the resin layer under which the light emitting source is disposed has a substantially uniform vertical thickness,

wherein the electrode part is electrically connected to the at least one bump ball.