Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
First Claim
Patent Images
1. A semiconductor chip assembly, comprising:
- a semiconductor device;
an adhesive that includes an opening;
a heat spreader that includes a bump and a flange, wherein (i) the bump includes first, second and third bent corners with the second bent corner between the first and third bent corners, is adjacent to the flange at the first bent corner, is spaced from the flange at the second and third bent corners, is integral with the flange and extends from the flange in a second vertical direction opposite a first vertical direction, (ii) the flange extends laterally from the bump in lateral directions orthogonal to the vertical directions, and (iii) a cavity in the bump faces in the first vertical direction, is covered by the bump in the second vertical direction, is shaped by the first, second and third bent corners and has an entrance at the flange, a first angle between the first and second bent corners and a second angle between the second and third bent corners; and
a conductive trace that includes a pad and a terminal;
wherein the semiconductor device is located within the cavity, extends beyond the first bent corner in the second vertical direction but not the first vertical direction, extends beyond the second bent corner in the first and second vertical directions and extends beyond the third bent corner in the first vertical direction but not the second vertical direction, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the bump;
wherein the adhesive contacts the bump and the flange and extends laterally from the bump to or beyond the terminal;
wherein the conductive trace is located outside the cavity;
wherein the bump extends into the opening, covers the semiconductor device in the second vertical direction and provides a recessed die paddle and a reflector for the semiconductor device; and
wherein the cavity extends into the opening.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump that includes first, second and third bent corners that shape a cavity. The conductive trace includes a pad and a terminal. The semiconductor device is located within the cavity, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends into an opening in the adhesive and provides a recessed die paddle and a reflector for the semiconductor device. The conductive trace provides signal routing between the pad and the terminal.
93 Citations
65 Claims
-
1. A semiconductor chip assembly, comprising:
-
a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a bump and a flange, wherein (i) the bump includes first, second and third bent corners with the second bent corner between the first and third bent corners, is adjacent to the flange at the first bent corner, is spaced from the flange at the second and third bent corners, is integral with the flange and extends from the flange in a second vertical direction opposite a first vertical direction, (ii) the flange extends laterally from the bump in lateral directions orthogonal to the vertical directions, and (iii) a cavity in the bump faces in the first vertical direction, is covered by the bump in the second vertical direction, is shaped by the first, second and third bent corners and has an entrance at the flange, a first angle between the first and second bent corners and a second angle between the second and third bent corners; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is located within the cavity, extends beyond the first bent corner in the second vertical direction but not the first vertical direction, extends beyond the second bent corner in the first and second vertical directions and extends beyond the third bent corner in the first vertical direction but not the second vertical direction, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the bump; wherein the adhesive contacts the bump and the flange and extends laterally from the bump to or beyond the terminal; wherein the conductive trace is located outside the cavity; wherein the bump extends into the opening, covers the semiconductor device in the second vertical direction and provides a recessed die paddle and a reflector for the semiconductor device; and wherein the cavity extends into the opening. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A semiconductor chip assembly, comprising:
-
a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a bump, a base and a flange, wherein (i) the bump includes first, second and third bent corners with the second bent corner between the first and third bent corners, is adjacent to the flange at the first bent corner and is spaced from the flange at the second and third bent corners, is adjacent to the base at the third bent corner and is spaced from the base at the first and second bent corners, is integral with the flange, extends from the base in a first vertical direction and extends from the flange in a second vertical direction opposite the first vertical direction, (ii) the base extends from the bump in the second vertical direction and extends laterally from the bump in lateral directions orthogonal to the vertical directions, (iii) the flange extends laterally from the bump and is spaced from the base, and (iv) a cavity in the bump faces in the first vertical direction, is covered by the bump in the second vertical direction, is spaced from the base by the bump, extends across most of the bump in the vertical and lateral directions, is shaped by the first, second and third bent corners and has an entrance at the flange, a first angle between the first and second bent corners and a second angle between the second and third bent corners; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is located within the cavity, extends beyond the first bent corner in the second vertical direction but not the first vertical direction, extends beyond the second bent corner in the first and second vertical directions and extends beyond the third bent corner in the first vertical direction but not the second vertical direction, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the bump and thereby thermally connected to the base; wherein the adhesive contacts the bump, the base and the flange, is sandwiched between the base and the flange and extends laterally from the bump to or beyond the terminal; wherein the conductive trace is located outside the cavity; wherein the bump extends into the opening, covers the semiconductor device in the second vertical direction and provides a recessed die paddle and a reflector for the semiconductor device; and wherein the cavity extends into the opening. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
-
-
31. A semiconductor chip assembly, comprising:
-
a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a bump, a base and a flange, wherein (i) the bump includes first, second and third bent corners with the second bent corner between the first and third bent corners, is adjacent to the flange at the first bent corner and is spaced from the flange at the second and third bent corners, is adjacent to the base at the third bent corner and is spaced from the base at the first and second bent corners, is integral with the flange, extends from the base in a first vertical direction and extends from the flange in a second vertical direction opposite the first vertical direction, (ii) the base extends from and covers the bump in the second vertical direction and extends laterally from the bump in lateral directions orthogonal to the vertical directions, (iii) the flange extends laterally from the bump and is spaced from the base, and (iv) a cavity in the bump faces in the first vertical direction, is covered by the bump in the second vertical direction, is spaced from the base by the bump, extends across most of the bump in the vertical and lateral directions, is shaped by the first, second and third bent corners and has an entrance at the flange, a first angle between the first and second bent corners and a second angle between the second and third bent corners; a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is located within the cavity, extends beyond the first bent corner in the second vertical direction but not the first vertical direction, extends beyond the second bent corner in the first and second vertical directions and extends beyond the third bent corner in the first vertical direction but not the second vertical direction, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the bump and thereby thermally connected to the base; wherein the adhesive contacts the bump, the base, the flange and the dielectric layer, is sandwiched between the bump and the dielectric layer, between the flange and the dielectric layer and between the base and the flange, extends laterally from the bump to or beyond the terminal and extends to peripheral edges of the assembly; wherein the conductive trace is located outside the cavity; wherein the bump extends into the opening and the aperture, covers the semiconductor device in the second vertical direction and provides a recessed die paddle and a reflector for the semiconductor device; and wherein the cavity extends into the opening and the aperture. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50)
-
-
51. A semiconductor chip assembly, comprising:
-
a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a bump, a base and a flange, wherein (i) the bump includes first, second and third bent corners, first and second sidewalls and a floor, the second bent corner is between the first and third bent corners, the first sidewall extends between the first and second bent corners, the second sidewall extends between the second and third bent corners and the floor is adjacent to the third bent corner, and the bump is adjacent to the flange at the first bent corner and is spaced from the flange at the second and third bent corners, is adjacent to the base at the third bent corner and is spaced from the base at the first and second bent corners, is integral with the flange, extends from the base in a first vertical direction and extends from the flange in a second vertical direction opposite the first vertical direction, (ii) the base extends from and covers the bump in the second vertical direction and extends laterally from the bump in lateral directions orthogonal to the vertical directions, (iii) the flange extends laterally from the bump and is spaced from the base, and (iv) a cavity in the bump faces in the first vertical direction, is covered by the bump in the second vertical direction, is spaced from the base by the bump, extends across most of the bump in the vertical and lateral directions, is shaped by the first, second and third bent corners, the first and second sidewalls and the floor and has an entrance at the flange, a first angle relative to the floor at the first sidewall and a second angle relative to the floor at the second sidewall; a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; and a conductive trace that includes a pad, a terminal and a plated through-hole, wherein the plated through-hole in is an electrically conductive path between the pad and the terminal; wherein the semiconductor device is located within the cavity, extends beyond the first bent corner in the second vertical direction but not the first vertical direction, extends beyond the second bent corner in the first and second vertical directions and extends beyond the third bent corner in the first vertical direction but not the second vertical direction, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the bump and thereby thermally connected to the base; wherein the adhesive contacts the dielectric layer inside and outside the aperture, is sandwiched between the bump and the dielectric layer, between the bump and the plated through-hole, between the flange and the dielectric layer and between the base and the flange, extends laterally from the bump to or beyond the terminal and extends to peripheral edges of the assembly; wherein the conductive trace is located outside the cavity, the pad contacts the adhesive, is spaced from the dielectric layer and extends beyond the adhesive and the dielectric layer in the first vertical direction, the terminal contacts the dielectric layer, is spaced from the adhesive and extends beyond the adhesive and the dielectric layer in the second vertical direction and the plated through-hole contacts and extends through the adhesive and the dielectric layer; wherein the bump contacts the adhesive, is spaced from the dielectric layer, extends into the opening and the aperture, covers the semiconductor device in the second vertical direction and provides a recessed die paddle and a reflector for the semiconductor device; wherein the base contacts the adhesive and the dielectric layer, covers the flange in the second vertical direction, extends laterally beyond the flange and extends beyond the adhesive and the dielectric layer in the second vertical direction; wherein the flange contacts the adhesive, is spaced from the dielectric layer and extends beyond the adhesive and the dielectric layer in the first vertical direction; and wherein the cavity extends into the opening and the aperture. - View Dependent Claims (52, 53, 54, 55)
-
-
56. A semiconductor chip assembly, comprising:
-
an LED chip; an adhesive that includes an opening; a heat spreader that includes a bump, a base and a flange, wherein (i) the bump includes first, second and third bent corners with the second bent corner between the first and third bent corners, is adjacent to the flange at the first bent corner and is spaced from the flange at the second and third bent corners, is adjacent to the base at the third bent corner and is spaced from the base at the first and second bent corners, is integral with the flange, extends from the base in a first vertical direction and extends from the flange in a second vertical direction opposite the first vertical direction, (ii) the base extends from and covers the bump in the second vertical direction and extends laterally from the bump in lateral directions orthogonal to the vertical directions, (iii) the flange extends laterally from the bump and is spaced from the base, and (iv) a cavity in the bump faces in the first vertical direction, is covered by the bump in the second vertical direction, is spaced from the base by the bump, extends across most of the bump in the vertical and lateral directions, is shaped by the first, second and third bent corners and has an entrance at the flange, a first angle between the first and second bent corners and a second angle between the second and third bent corners; a conductive trace that includes a pad and a terminal; and an encapsulant; wherein the LED chip is located within the cavity, extends beyond the first bent corner in the second vertical direction but not the first vertical direction, extends beyond the second bent corner in the first and second vertical directions and extends beyond the third bent corner in the first vertical direction but not the second vertical direction, is electrically connected to the pad by a wire bond and thereby electrically connected to the terminal, and is thermally connected to the bump by a die attach and thereby thermally connected to the base; wherein the encapsulant contacts the LED chip, the wire bond, the die attach and the bump in the cavity, is spaced from the conductive trace, the base and the adhesive and covers the LED chip in the first vertical direction; wherein the adhesive contacts the bump, the base and the flange, is sandwiched between the base and the flange and extends laterally from the bump to or beyond the terminal; wherein the die attach is located within the cavity, the wire bond extends within and outside the cavity and the conductive trace is located outside the cavity; wherein the bump extends into the opening, covers the LED chip in the second vertical direction and provides a recessed die paddle and a reflector for the LED chip; and wherein the cavity extends into the opening. - View Dependent Claims (57, 58, 59, 60, 61, 62, 63, 64, 65)
-
Specification