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Interleaved three-dimensional on-chip differential inductors and transformers

  • US 8,325,001 B2
  • Filed: 08/02/2006
  • Issued: 12/04/2012
  • Est. Priority Date: 08/04/2005
  • Status: Active Grant
First Claim
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1. An inductive 3D on-chip apparatus comprising:

  • a first coil and a second coil disposed separately across multiple layers;

    wherein said first and second coils each comprise successively connected partial windings centered on a common axis;

    wherein the partial windings of the first coil are interleaved on successive layers of said multiple layers with the partial windings of the second coil; and

    wherein said first coil and said second coil each comprise partial windings which alternate between a first average diameter and a second average diameter across said multiple layers in relation to said common axis to separate said adjacent partial windings both vertically and horizontally;

    wherein said first average diameter and said second average diameter have different values.

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