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Digital envelope modulator for haptic feedback devices

  • US 8,325,144 B1
  • Filed: 10/17/2007
  • Issued: 12/04/2012
  • Est. Priority Date: 10/17/2007
  • Status: Active Grant
First Claim
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1. A haptic feedback device comprising:

  • a user interface device;

    a transducer coupled to the user interface device and configured to impart a haptic force to the user interface device at a resonance frequency of the haptic feedback device based on an output signal;

    a sensor configured to output a sensor signal; and

    a signal generation module comprising a programmable microcontroller, the signal generation module configured to determine the resonance frequency based on the sensor signal and to provide the output signal, wherein the output signal is a composite signal comprising a carrier component and an envelope component, and wherein the microcontroller is programmable to control at least one of the carrier component or the envelope component to change the haptic force based on the sensor signal and a change to the resonance frequency caused by an external force.

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