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Bone-conduction microphone built-in headset

  • US 8,325,963 B2
  • Filed: 12/08/2009
  • Issued: 12/04/2012
  • Est. Priority Date: 01/05/2009
  • Status: Expired due to Fees
First Claim
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1. A bone-conduction microphone built-in headset comprising:

  • an ear pad;

    an ear cup capable of covering an ear;

    a piezoelectric element composing a bone-conduction microphone;

    a buffer material forming the ear pad;

    a baffle board provided between the ear pad and the ear cup;

    a wire laid from the piezoelectric element to a first connector,wherein the ear pad is provided on an opening end side of the ear cup,the piezoelectric element is provided inside the ear pad and supported by the buffer material to be pressed against a skin around the ear,the ear pad is detachably attached to the baffle board, andthe baffle board has a second connecter which is configured to matchingly engage with the first connector to connect to the wire.

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