Wireless IC device and component for wireless IC device

• US 8,326,223 B2
• Filed: 03/01/2010
• Issued: 12/04/2012
• Est. Priority Date: 01/19/2006
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Dokai, Yuya, Kato, Noboru, Ishino, Satoshi
• Primary Examiner(s): Trinh, Sonny
• Application Number:
  US12/714,607
• Publication Number:
  US 20100156563A1
• Time in Patent Office: 1,009 Days
• Field of Search: 455/41.2, 455/41.1, 455/334, 455/39, 455/42, 455/327, 455/333, 455/130, 340/10.1, 340/10.3, 340/10.42
• US Class Current: 455/41.1
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10727 : Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: Y02D 30/70 : in wireless communication networks

Abstract

A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

Claims

1. A feed circuit, comprising:

a resonant circuit having a predetermined resonant frequency, wherein;

the resonant circuit comprises a first resonant circuit including a first inductor element and a second resonant circuit including a second inductor element;

the first inductor element and the second inductor element are electronically connected to each other in parallel and are magnetically coupled with each other; and

the feed circuit is configured to feed a signal with a specified frequency to a radiation plate and/or to receive a signal with a specified frequency from the radiation plate.

2. The feed circuit according to claim 1, further comprising a plurality of terminals,

wherein the first inductor element and the second inductor element are connected in parallel between the plurality of terminals.

3. The feed circuit according to claim 1, wherein:

one end of the first inductor element is connected to one end of the second inductor element; and

the other end of the first inductor element is connected to the end other end of the second inductor element.

4. The feed circuit according to claim 1, wherein the first resonant circuit and the second resonant circuit are distributed-constant resonant circuits.

5. The feed circuit according to claim 1, wherein the first resonant circuit and the second resonant circuit are concentrated-constant resonant circuits, the first resonant circuit comprising a first capacitor element and the second resonant circuit comprising a second capacitor element.

6. The feed circuit according to claim 5, wherein:

the first capacitor element is connected between the first inductor element and a terminal; and

the second capacitor element is connected between the first inductor element and the second inductor element.

7. The feed circuit according to claim 1, further comprising a multilayer substrate comprising a plurality of dielectric layers or magnetic layers stacked one upon another,

wherein a coil-shaped electrode pattern serving as the first inductor element and a coil-shaped electrode pattern serving as the second inductor element are formed on a surface of or inside of the multilayer substrate.

8. The feed circuit according to claim 1, wherein

the radiation plate has an electrical length that is an integer multiple of a half wavelength of the resonant frequency of the resonant circuit.