Method for production and using a capacitive micro-machined ultrasonic transducer

• US 8,327,521 B2
• Filed: 09/17/2008
• Issued: 12/11/2012
• Est. Priority Date: 09/17/2007
• Status: Active Grant

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Dirksen, Peter, Van Der Lugt, Anthonie
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US12/678,453
• Publication Number:
  US 20100207485A1
• Time in Patent Office: 1,546 Days
• Field of Search: 29/254.1, 295/921, 295/94, 296/091, 257/704, 257/723, 257/724, 257/729, 257/730, 381/113, 381/116, 381/171, 381173-178, 381/181, 381/182, 381/190, 381/191, 381/427, 381/431
• US Class Current: 29/594
• CPC Class Codes: A61B 8/00 Diagnosis using ultrasonic, sonic or infrasonic waves imaging of objects using sonar G01S15/00
• CPC Class Codes: B06B 1/0292 Electrostatic transducers, e.g. electret-type
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: Y10T 29/43 Electric condenser making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer

Abstract

Methods are provided for production of pre-collapsed capacitive micro-machined ultrasonic transducers (cMUTs). Methods disclosed generally include the steps of obtaining a nearly completed traditional cMUT structure prior to etching and sealing the membrane, defining holes through the membrane of the cMUT structure for each electrode ring fixed relative to the top face of the membrane, applying a bias voltage across the membrane and substrate of the cMUT structure so as to collapse the areas of the membrane proximate to the holes to or toward the substrate, fixing and sealing the collapsed areas of the membrane to the substrate by applying an encasing layer, and discontinuing or reducing the bias voltage. CMUT assemblies are provided, including packaged assemblies, integrated assemblies with an integrated circuit/chip (e.g., a beam-steering chip) and a cMUT/lens assembly. Advantageous cMUT-based applications utilizing the disclosed pre-collapsed cMUTs are also provided, e.g., ultrasound transducer-based applications, catheter-based applications, needle-based applications and flowmeter applications.

Claims

1. A method for producing a capacitive micro-machined ultrasonic transducer (cMUT), comprising:

a. providing a cMUT structure, wherein the cMUT structure defines one or more cMUT elements that include;

(i) a substrate layer, (ii) an electrode plate, (iii) a membrane layer, and (iv) an electrode ring;

b. defining at least one hole through the membrane layer for each cMUT element;

c. applying a bias voltage across the membrane and substrate layers of the one or more cMUT elements so as to collapse the membrane layer relative to the substrate layer; and

d. fixing and sealing the collapsed membrane layer relative to the substrate layer by applying an encasing layer.

2. The method according to claim 1, further comprising:

(i) discontinuing the bias voltage, or (ii) reducing the bias voltage to an operating voltage.

3. The method according to claim 1, wherein the bias voltage is a well-defined DC voltage supplied by a battery.

4. The method according to claim 3, wherein the well-defined DC voltage falls between 10 and 250V.

5. The method according to claim 1, wherein the bias voltage is effective to regulate the amount of collapse.

6. The method according to claim 5, wherein the regulation of the amount of collapse is effective to optimize performance.

7. The method according to claim 1, wherein the at least one hole is between about 1 and 25 microns in diameter.

8. The method according to claim 1, wherein the at least one hole is defined using an optical lithography technique selected from the group consisting of g-line lithography, i-line lithography, nano-imprint lithography and e-beam lithography.

9. The method according to claim 1, wherein the electrode plate is a circular electrode plate fabricated from a metallic or non-metallic conductive material.

10. The method according to claim 9, wherein an outer diameter of the electrode ring is configured and dimensioned to substantially match a diameter of the circular electrode plate and wherein a center of electrode the ring and a center of the circular electrode plate are substantially aligned.

11. The method according to claim 1, wherein the substrate layer comprises silicon.

12. The method according to claim 1, wherein the membrane layer comprises a CMOS compatible material comprising one of silicon nitride, an oxide, tetra ethyl oxysilane (TEOS), or poly-silicon.

13. The method according to claim 1, wherein the encasing layer comprises a CMOS compatible material comprising one of silicon nitride, an oxide, tetra ethyl oxysilane (TEOS), or poly-silicon.

14. The method according to claim 1, wherein the electrode plate is a metallic or non-metallic conductive material.

15. The method according to claim 1, wherein the cMUT is fabricated, at least in part, using plasma-enhanced chemical vapor deposition (PECVD) and/or low pressure chemical vapor deposition (LPCVD).

16. The method according to claim 1, wherein the electrode plate of the cMUT element is fixed relative to a top surface of the substrate layer.

17. The method according to claim 1, wherein the membrane of the cMUT element is fixed relative to a top face of the substrate layer so as to define a cavity between the membrane and the substrate layer.

18. The method according to claim 1, wherein the electrode ring is fixed relative to a top surface of the membrane layer.

19. The method according to claim 1, wherein the at least one hole is defined through the membrane layer relative to a center of the electrode ring.

20. The method according to claim 1, wherein a diameter of the at least one hole is less than an inner diameter of the electrode ring.

21. The method according to claim 1, wherein an area of collapse of the membrane layer is proximate to the hole.

22. The method according to claim 1, wherein the bias voltage is:

(i) maintained throughout the fixing and sealing process, (ii) reduced prior to the fixing and sealing process, (iii) reduced during the fixing and sealing process;

or (iv) a combination thereof.