Method for adjusting resonance frequencies of a vibrating microelectromechanical device
First Claim
1. A method for adjusting the resonant frequencies of a vibrating mass comprising the steps of:
- patterning a surface of a device layer of the vibrating mass with a mask;
etching the vibrating mass to define a structure of the vibrating mass;
determining a first set of resonant frequencies of the vibrating mass;
determining a mass removal amount of the vibrating mass and a mass removal location of the vibrating mass to obtain a second set of resonant frequencies of the vibrating mass;
removing a portion of the mask only at the mass removal location, wherein removing the portion of the mask only at the mass removal location is performed using laser ablation; and
etching the vibrating mass through the removed portion of the mask to remove the mass removal amount of the vibrating mass at the mass removal location of the vibrating mass.
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Abstract
The present invention relates to a method for adjusting the resonant frequencies of a vibrating microelectromechanical (MEMS) device. In one embodiment, the present invention is a method for adjusting the resonant frequencies of a vibrating mass including the steps of patterning a surface of a device layer of the vibrating mass with a mask, etching the vibrating mass to define a structure of the vibrating mass, determining a first set of resonant frequencies of the vibrating mass, determining a mass removal amount of the vibrating mass and a mass removal location of the vibrating mass to obtain a second set of resonant frequencies of the vibrating mass, removing the mask at the mass removal location, and etching the vibrating mass to remove the mass removal amount of the vibrating mass at the mass removal location of the vibrating mass.
26 Citations
14 Claims
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1. A method for adjusting the resonant frequencies of a vibrating mass comprising the steps of:
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patterning a surface of a device layer of the vibrating mass with a mask; etching the vibrating mass to define a structure of the vibrating mass; determining a first set of resonant frequencies of the vibrating mass; determining a mass removal amount of the vibrating mass and a mass removal location of the vibrating mass to obtain a second set of resonant frequencies of the vibrating mass; removing a portion of the mask only at the mass removal location, wherein removing the portion of the mask only at the mass removal location is performed using laser ablation; and etching the vibrating mass through the removed portion of the mask to remove the mass removal amount of the vibrating mass at the mass removal location of the vibrating mass. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification