In-line connector stack with testing capability

• US 8,328,587 B2
• Filed: 04/19/2010
• Issued: 12/11/2012
• Est. Priority Date: 04/20/2009
• Status: Active Grant

• Current Assignee: Bal Seal Engineering Incorporated (Kaman Corporation)
• Original Assignee: Bal Seal Engineering Incorporated (Kaman Corporation)
• Inventors: Dilmaghanian, Farshid
• Primary Examiner(s): Gilman, Alexander
• Application Number:
  US12/763,125
• Publication Number:
  US 20100267265A1
• Time in Patent Office: 967 Days
• Field of Search: 439/271, 439/736, 439/668, 439/669, 439/527, 298/56, 295/93, 607/37, 607/508, 607/836
• US Class Current: 439/827
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: H01R 13/2421 using coil springs
• CPC Class Codes: H01R 13/59 Threaded ferrule or bolt operating in a direction parallel to the cable or wire
• CPC Class Codes: H01R 2107/00 Four or more poles
• CPC Class Codes: H01R 2201/12 for medicine and surgery
• CPC Class Codes: H01R 24/58 Contacts spaced along longitudinal axis of engagement
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49172 by molding of insulating material

Abstract

Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.

Claims

1. A method for manufacturing an in-line connector comprising:

encapsulating an in-line connector stack with an encapsulation layer to form an encapsulated in-line stack, wherein;

the encapsulation layer comprises an elongated body defining a bore having a continuous length, a plurality of slots, and a section of the elongated body that is formed as a continuous integral element in a radial direction;

the in-line connector stack comprises a plurality of seal elements, a plurality of conductive contact elements, and a plurality of canted coil springs in contact with the plurality of conductive contact elements;

sliding the in-line connector stack inside the bore so that at least a portion of the in-line connector stack slides past the section that is continuous in the radial direction;

wherein a non-conductive end cap comprising an opening is disposed at each end of the in line connector stack; and

aligning the plurality of conductive contact elements with the plurality of slots on the encapsulation layer; and

wherein each of the plurality of canted coil springs is located in a groove comprising a back wall and two side walls formed from a combination of a conductive material and a non-conductive material.

2. The method of claim 1, wherein the encapsulation layer seals a plurality of seams formed between adjacent pairs of seal elements and conductive contact elements.

3. The method of claim 1, wherein the snap fit end cap has an entry annular seal for sealing against a lead cable.

4. The method of claim 1, wherein the in-line connector stack is placed into the bore through one end of the encapsulation layer.

5. The method of claim 1, further comprising placing the encapsulated in-line stack into a bore of a pre-formed header.

6. The method of claim 5, wherein the encapsulated in-line stack is pre-tested prior to placing into the bore of the header.

7. The method of claim 5, further comprising engaging a snap fit end cap against an end opening of the header to retain the encapsulated in-line stack within the bore of the pre-formed header.

8. The method of claim 7, wherein the snap fit end cap and the bore of the header exert an axial compressive force on the encapsulated in-line stack.

9. The method of claim 5, wherein the pre-formed header comprises a plurality of slots.

10. The method of claim 9, wherein the plurality of slots of the pre-formed header are aligned with the plurality of slots on the encapsulation layer.

11. The method of claim 1, wherein the encapsulation layer comprises a non-conductive continuous cylindrical body forming a cavity for receiving the plurality of seal elements and conductive contact elements.

12. A connector header assembly comprising a header comprising a bore, an in-line connector stack comprising a plurality of alternating seal elements, a plurality of canted coil springs, and conductive contact elements encapsulated by an encapsulation layer to form an encapsulated in-line stack positioned inside the bore of the header, and a snap fit end cap comprising a bore mechanically engaged to the header to retain the encapsulated in-line stack within the bore of the header, the snap fit end cap and the header define a seam therebetween, and wherein the header comprises a plurality of slots aligned with a plurality of slots formed on the encapsulation layer and wherein the encapsulation layer comprises an elongated body that is continuous along a length and continuous in a radial direction without a seam.

13. The connector header assembly of claim 12, further comprising a first end cap attached to a first end of the encapsulation layer and a second end cap attached to a second end of the encapsulation layer, said first and second end caps each comprising an opening.

14. The connector header assembly of claim 12, wherein the encapsulated in-line stack is formed before being placed inside the bore of the header.

15. The connector header assembly of claim 14, wherein the snap fit end cap and the bore of the header exert an axial compressive force on the encapsulated in-line stack.

16. The connector header assembly of claim 12, wherein the snap fit end cap comprises an opening for accessing a fastener.

17. The connector header assembly of claim 12, wherein the encapsulation layer seals a plurality of seams formed between adjacent pairs of seal elements and conductive contact elements.

18. The connector header assembly of claim 12, further comprising a second bore for receiving a second encapsulated in-line stack.

19. The connector header assembly of claim 12, further comprising an opening on the header for placing a holding ring therethrough.

20. A method for manufacturing an in-line connector comprising:

forming an encapsulated in-line stack by sliding a plurality of seal elements, springs, and conductive contact elements through a firstend opening of a cylindrical housing comprising a bore, a continuous housing section along a radial direction, and the first end opening and a second end opening, said cylindrical housing further comprising a plurality of slots formed laterally of the first opening;

engaging an end cap to the first end opening of the cylindrical housing;

aligning the plurality of conductive contact elements with the plurality of slots on the cylindrical housing; and

testing the encapsulated stack by applying an electrical signal across at least one of the conductive contact elements.

21. The method of claim 20, further comprising placing the encapsulated stack into a bore of a pre-formed header.