Stretchable circuit configuration
First Claim
1. A method of embedding a surface mount device (SMD) package into a stretchable electronic circuit, comprising:
- forming an SMD mold by mounting an outer face of a first SMD package to a rigid plate, the first SMD package having conductor contact protrusions;
positioning the SMD mold onto a stretchable base substrate having stretchable conductors formed onto a surface thereof, and with the conductor contact protrusions of the first SMD package contacting the stretchable conductors;
filling a volume between the base substrate and the rigid plate with uncured stretchable fill material;
curing the fill material to form a stretchable sensor layer;
removing the SMD mold to expose an SMD cavity formed into the stretchable fill layer; and
installing a second SMD package into the SMD cavity, with conductor contact protrusions of the second SMD package being in electrical communication with the stretchable conductors on the base substrate to form a stretchable electronic circuit.
2 Assignments
0 Petitions
Accused Products
Abstract
A stretchable electronic circuit that includes a stretchable base substrate having a plurality of stretchable conductors formed onto a surface thereof, with both the stretchable base substrate and conductors being bendable together about two orthogonal axes. The stretchable circuit also includes a stretchable sensor layer attached to the base substrate with a cavity formed therein which has a contact point exposing one of the plurality of stretchable conductors. The stretchable electronic circuit further includes a surface mount device (SMD) package with a conductor contact protrusion installed into the cavity, and wherein a substantially constant electrical connection is established between the conductor contact protrusion and the stretchable conductor at the contact point by tensile forces interacting between the stretchable base substrate and the stretchable sensor layer.
24 Citations
12 Claims
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1. A method of embedding a surface mount device (SMD) package into a stretchable electronic circuit, comprising:
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forming an SMD mold by mounting an outer face of a first SMD package to a rigid plate, the first SMD package having conductor contact protrusions; positioning the SMD mold onto a stretchable base substrate having stretchable conductors formed onto a surface thereof, and with the conductor contact protrusions of the first SMD package contacting the stretchable conductors; filling a volume between the base substrate and the rigid plate with uncured stretchable fill material; curing the fill material to form a stretchable sensor layer; removing the SMD mold to expose an SMD cavity formed into the stretchable fill layer; and installing a second SMD package into the SMD cavity, with conductor contact protrusions of the second SMD package being in electrical communication with the stretchable conductors on the base substrate to form a stretchable electronic circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification