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Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate

  • US 8,329,590 B2
  • Filed: 11/09/2009
  • Issued: 12/11/2012
  • Est. Priority Date: 12/03/2004
  • Status: Expired due to Fees
First Claim
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1. A method for plasma treating a substrate in a processing space of the vacuum chamber, the substrate having a first side, a plurality of features projecting from the first side, a second side opposite to the first side, and an extraneous material on the second side, the method comprising:

  • covering the first side of the substrate with a mask having a plurality of concavities each positioned and dimensioned to receive a respective one of the plurality of features projecting from the first side of the substrate;

    sealing about each of the plurality of concavities to prevent the ingress of a plasma into the plurality of concavities;

    securing the substrate between the mask and an upper frame having a plurality of windows;

    generating a plasma in the processing space; and

    passing the plasma through the plurality of windows in the upper frame into contact with the extraneous material on the second side of the substrate to remove the extraneous material.

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