Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate

• US 8,329,590 B2
• Filed: 11/09/2009
• Issued: 12/11/2012
• Est. Priority Date: 12/03/2004
• Status: Expired due to Fees

• Current Assignee: Nordson Corporation
• Original Assignee: Nordson Corporation
• Inventors: Condrashoff, Robert S., Getty, James D., Tyler, James S.
• Primary Examiner(s): Vinh, Lan
• Assistant Examiner(s): Lu, Jiong-Ping
• Application Number:
  US12/614,551
• Publication Number:
  US 20100075505A1
• Time in Patent Office: 1,128 Days
• Field of Search: None
• US Class Current: 438/710
• CPC Class Codes: C23F 4/00 Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
• CPC Class Codes: H01J 37/32623 Mechanical discharge control means
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Apparatus and methods for shielding a feature projecting from a first area on a substrate to a plasma while simultaneously removing extraneous material from a different area on the substrate with the plasma. The apparatus includes at least one concavity positioned and dimensioned to receive the feature such that the feature is shielded from the plasma. The apparatus further includes a window through which the plasma removes the extraneous material. The method generally includes removing the extraneous material while shielding the feature against plasma exposure.

Claims

1. A method for plasma treating a substrate in a processing space of the vacuum chamber, the substrate having a first side, a plurality of features projecting from the first side, a second side opposite to the first side, and an extraneous material on the second side, the method comprising:

covering the first side of the substrate with a mask having a plurality of concavities each positioned and dimensioned to receive a respective one of the plurality of features projecting from the first side of the substrate;

sealing about each of the plurality of concavities to prevent the ingress of a plasma into the plurality of concavities;

securing the substrate between the mask and an upper frame having a plurality of windows;

generating a plasma in the processing space; and

passing the plasma through the plurality of windows in the upper frame into contact with the extraneous material on the second side of the substrate to remove the extraneous material.

2. The method of claim 1 wherein sealing about each of the plurality of concavities further comprises:

contacting the mask with the first side of the substrate about the perimeter of each of the concavities.

3. The method of claim 1 further comprising:

placing the mask, the upper frame, and the substrate on a powered electrode used to generate the plasma in the processing space; and

orienting the substrate so that the second side of the substrate faces away from the powered electrode.

4. The method of claim 3 further comprising:

positioning the mask and the substrate into a recess defined in a lower plate so that the substrate and the mask are positioned between the upper frame and the lower plate; and

establishing electrical and thermal contact between the upper frame and the lower plate.

5. The method of claim 4 wherein the lower plate includes an annular rim projecting toward the upper frame and the recess is defined below a plane containing the annular rim, and wherein establishing the electrical and thermal contact between the upper frame and the lower plate comprises:

contacting the annular rim with the upper plate to establish the electrical and thermal contact between the upper frame and the lower plate.

6. The method of claim 1 wherein the extraneous material is flash comprised of a molding material.

7. A method for plasma treating a substrate in a processing space of the vacuum chamber, the substrate having a first side, a plurality of features projecting from the first side, a second side opposite to the first side, and an extraneous material on the second side, the method comprising:

positioning a mask in the processing space, the mask having a plurality of concavities each positioned and dimensioned to receive a respective one of the plurality of features projecting from the first side of the first substrate;

after the mask is positioned in the processing space, associating the substrate with the mask such that the plurality of features are received in the plurality of concavities with each concavity sealed with the first side of the substrate to prevent the ingress of a plasma into the plurality of concavities;

generating a plasma in the processing space; and

exposing the second side of the substrate to the plasma to remove the extraneous material,

wherein the extraneous material is flash comprised of a molding material.

8. The method of claim 7 further comprising:

contacting the mask with the first side of the substrate to seal about the perimeter of each of the concavities.

9. The method of claim 7 wherein positioning the mask in the processing space further comprises:

placing the mask and the substrate on a powered electrode used to generate the plasma in the processing space; and

orienting the substrate so that the second side of the substrate faces away from the powered electrode.