Antenna in package with reduced electromagnetic interaction with on chip elements
First Claim
Patent Images
1. An integrated circuit package for an electronic device comprising:
- a substrate having a mounting area for an integrated circuit die;
a set of electrical conductors provided on the substrate for connection between the die and external package connectors;
a set of electrically inert fixation pads to provide mechanical connections between the package and a printed circuit board on which the package is mounted;
an antenna comprising a feeding point, a proximal end, and a distal end, wherein the proximal end is closer than the distal end to the feeding point;
wherein the electrical conductors are provided on the substrate outside a projection area of the antenna;
a ground plane that is spaced away from the antenna so that no part of the ground plane falls in the projection of the antenna;
wherein the antenna is arranged on the substrate so that the distal end is farther than the proximal end to an edge of the ground plane; and
wherein at least one or more fixation pads are positioned in the projection area of the antenna.
1 Assignment
0 Petitions
Accused Products
Abstract
A IC package for a wireless device includes an antenna that is attached to the chip. The electrically conductive elements of the antenna are spaced away from the antenna and particularly the endpoint of the antenna to prevent interference with the antenna. An element on the IC package may be shielded antenna. The antenna may have the shape of a space-filling curve, including a Hilbert, box-counting or grid dimension curve.
-
Citations
50 Claims
-
1. An integrated circuit package for an electronic device comprising:
-
a substrate having a mounting area for an integrated circuit die; a set of electrical conductors provided on the substrate for connection between the die and external package connectors; a set of electrically inert fixation pads to provide mechanical connections between the package and a printed circuit board on which the package is mounted; an antenna comprising a feeding point, a proximal end, and a distal end, wherein the proximal end is closer than the distal end to the feeding point; wherein the electrical conductors are provided on the substrate outside a projection area of the antenna; a ground plane that is spaced away from the antenna so that no part of the ground plane falls in the projection of the antenna; wherein the antenna is arranged on the substrate so that the distal end is farther than the proximal end to an edge of the ground plane; and wherein at least one or more fixation pads are positioned in the projection area of the antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. An integrated circuit package, comprising:
-
a substrate having an area for mounting an integrated circuit die; an antenna provided on the substrate, having a projection area; a set of electrical conductors for carrying data signals for the integrated circuit die; wherein the electrical conductors are provided on the substrate in an area formed by the union of; a) a sub-area outside the projection area of the antenna, and b) a sub-area inside the projection area of the antenna and also inside an area that is a distance from a feedpoint of the antenna less than;
1) one-half of a side length of the integrated circuit package and
2) one-twenty-fourth of a free-space operating wavelength of the antenna. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
-
-
30. An integrated circuit package for an electronic device comprising:
-
a substrate having a mounting area for an integrated circuit die; a set of electrical conductors provided on the substrate for connection between the die and external package connectors; an antenna provided on the substrate, wherein the electrical conductors are provided on the substrate outside a projection area of the antenna; and a ground plane provided on the substrate, wherein the ground plane is spaced away from the antenna by at least the greater of one-quarter of a side length of the integrated circuit package and one-fiftieth of a free-space operating wavelength of the antenna, so that no part of the ground plane falls in the projection of the antenna. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 50)
-
-
43. A wireless device comprising:
-
a radio frequency (RF) communication integrated circuit package, including; an integrated circuit die; a plurality of connectors external to the integrated circuit package; a first set of electrically conductive elements coupled to the integrated circuit die providing connection between the integrated circuit die and the plurality of connectors external to the integrated circuit package; an antenna; the antenna and the first set of electrically conductive elements being spaced within the integrated circuit package such that no element of the first set of electrically conductive elements is in the projection of the antenna; a metallic shielding structure external to the integrated circuit die coupled to a ground potential and positioned within the integrated circuit package to electrically isolate the integrated circuit die from the antenna; and the antenna being arranged within the integrated circuit package such that at least a portion of the antenna is outside a projection of the metallic shielding structure. - View Dependent Claims (44, 45, 46)
-
-
47. An electronic device comprising:
-
a printed circuit board including a ground plane; an integrated circuit package mounted on the printed circuit board, the integrated circuit package including; a substrate having a mounting area for an integrated circuit die; an antenna element provided on the substrate, wherein the antenna element operates in cooperation with said ground plane; a feeding conductor provided on the substrate for connection between the integrated circuit die and the antenna element; a plurality of electrical conductors provided on the substrate for connection between the integrated circuit die and external package connectors, wherein the electrical conductors of the plurality of electrical conductors are provided on the substrate outside a projection area of the antenna element; wherein at least one of the external package connectors is coupled to said ground plane; and wherein the antenna element is located along two edges that form a corner on a first side of the integrated circuit package, and the electrical conductors of the plurality of electrical conductors are closer than the antenna element to an opposite corner of the integrated circuit package. - View Dependent Claims (48, 49)
-
Specification