Chip having a metal pillar structure
First Claim
1. A chip having a metal pillar structure, comprising:
- a chip body, having an active surface;
at least one chip pad, disposed on the active surface;
a first passivation layer, disposed on the active surface, and having at least one first opening so as to expose part of the chip pad;
an under ball metal layer (UBM), disposed on the chip pad; and
at least one metal pillar structure, disposed on the under ball metal layer (UBM), comprising;
a metal pillar, disposed on the under ball metal layer (UBM); and
a solder, disposed on the metal pillar, wherein the maximum diameter formed by the solder is shorter than or equal to the diameter of the metal pillar,further comprising a second passivation layer, wherein the second passivation layer is disposed on the first passivation layer and has at least one second opening so as to expose part of the chip pad.
1 Assignment
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Accused Products
Abstract
The present invention relates to a chip having a metal pillar structure. The chip includes a chip body, at least one chip pad, a first passivation layer, an under ball metal layer and at least one metal pillar structure. The chip body has an active surface. The chip pad is disposed on the active surface. The first passivation layer is disposed on the active surface, and has at least one first opening so as to expose part of the chip pad. The under ball metal layer is disposed on the chip pad. The metal pillar structure is disposed on the under ball metal layer, and includes a metal pillar and a solder. The metal pillar is disposed on the under ball metal layer. The solder is disposed on the metal pillar, and the maximum diameter formed by the solder is shorter than or equal to the diameter of the metal pillar. Therefore, when the pitch between two adjacent metal pillar structures of the chip is a fine pitch, the defect of solder bridge can be avoided, so that the yield rate is improved.
81 Citations
20 Claims
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1. A chip having a metal pillar structure, comprising:
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a chip body, having an active surface; at least one chip pad, disposed on the active surface; a first passivation layer, disposed on the active surface, and having at least one first opening so as to expose part of the chip pad; an under ball metal layer (UBM), disposed on the chip pad; and at least one metal pillar structure, disposed on the under ball metal layer (UBM), comprising; a metal pillar, disposed on the under ball metal layer (UBM); and a solder, disposed on the metal pillar, wherein the maximum diameter formed by the solder is shorter than or equal to the diameter of the metal pillar, further comprising a second passivation layer, wherein the second passivation layer is disposed on the first passivation layer and has at least one second opening so as to expose part of the chip pad. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A chip having a metal pillar structure, comprising:
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a chip body, having an active surface; at least one chip pad, disposed on the active surface; a first passivation layer, disposed on the active surface, and having at least one first opening so as to expose part of the chip pad; a second passivation layer, disposed on the first passivation layer, and having at least one second opening so as to expose part of the chip pad; an under ball metal layer (UBM), disposed on the chip pad and extending along a sidewall defined by the second opening of the second passivation layer; and at least one metal pillar structure, disposed on the under ball metal layer (UBM), comprising; a metal pillar, disposed on the under ball metal layer (UBM); and a solder, extending upwardly from the metal pillar, wherein the height of the solder is smaller than or equal to the radius of the metal pillar. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A semiconductor device, comprising:
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a chip comprising a pad disposed on an active surface of the chip; a first passivation layer disposed on the active surface, and having a first opening exposing the pad; a second passivation layer disposed over the first passivation layer, and having a second opening exposing the pad; a metal pillar disposed at least partially within the first opening and the second opening, and electrically connected to the pad; and a solder disposed over an upper surface of the metal pillar. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification