Plasma reactor with plasma load impedance tuning for engineered transients by synchronized modulation of an unmatched low power RF generator

• US 8,337,661 B2
• Filed: 05/29/2008
• Issued: 12/25/2012
• Est. Priority Date: 05/29/2008
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Shannon, Steven C., Ramaswamy, Kartik, Hoffman, Daniel J., Miller, Matthew L., Collins, Kenneth S.
• Primary Examiner(s): Kackar, Ram N.
• Application Number:
  US12/128,926
• Publication Number:
  US 20090294061A1
• Time in Patent Office: 1,671 Days
• Field of Search: 118/723.R, 156/345.24, 156/345.28, 156/345.43, 156/345.47, 156/345.44, 156/345.48
• US Class Current: 156/345.28
• CPC Class Codes: H01J 37/32091 the radio frequency energy being capacitively coupled to the plasma
• CPC Class Codes: H01J 37/32183 Matching circuits
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge

Abstract

A plasma reactor for processing a workpiece such as a semiconductor wafer using predetermined transients of plasma bias power or plasma source power has unmatched low power RF generators synchronized to the transients to minimize transient-induced changes in plasma characteristics.

Claims

1. A plasma reactor for processing a workpiece, comprising:

plural impedance matches and plural RF plasma power generators coupled to deliver respective RF plasma powers from respective ones of said plural RF plasma power generators into said chamber through respective ones of said impedance matches;

a controller for providing a time-varying modulation control signal corresponding to a desired process transient cycle and a transient modulator coupled to modulate the output of a first one of said generators in response to said time-varying modulation control signal; and

a stabilization RF power generator separate from said plural RF plasma power generators and coupled to deliver RF stabilization power into said chamber, and a follower modulator coupled to modulate the output of said stabilization RF power generator in response to said time-varying modulation control signal;

wherein;

said first generator comprises a sensor output providing a signal representing a measured level of RF power reflected back to the generator, said signal being coupled to said controller;

said controller being programmed to alter the degree of modulation of said stabilization RF power generator to minimize said measured level of RF power reflected back to said generator.

2. The reactor of claim 1 wherein said first generator is an RF plasma source power generator, and

wherein said stabilization RF power has a frequency at which over 80% of RF power contributes to plasma sheath thickness.

3. The reactor of claim 2 wherein said frequency of said RF stabilization power is in or below the LF frequency range.

4. The reactor of claim 1 wherein said reactor comprises a workpiece support electrode, and said stabilization power generator is coupled through said follower modulator to said support erectrode.

5. The reactor of claim 1 wherein said stabilization RF power generator has an output power level that is less than that of said first generator, said stabilization RF power generator being coupled to deliver RF power without an impedance match element at its output.

6. The reactor of claim 1 wherein said follower modulator comprises an R-C circuit for imposing a delay in the output of said stabilization RF power generator relative to said control signal.

7. The reactor of claim 1 wherein said time-varying modulation control signal corresponds to a transient that is one of (a) rectangular wave pulsing, (b) triangular wave.