LED chip-based lighting products and methods of building
First Claim
1. A method of building a light-emitting diode (LED) chip-based lighting product, comprising:
- mounting a plurality of unpackaged LED chips directly on conductors formed on a first surface of a two-sided panel that includes a second surface counterfacing the first surface;
integrating the panel with support structure to form the lighting product such that at least part of the second surface forms an external surface of the lighting product; and
coupling a diffuser with the support structure, with a distance from the diffuser to the surface of the LED chips being at least twice an average spacing between adjacent ones of the LED chips.
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Abstract
A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.
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Citations
19 Claims
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1. A method of building a light-emitting diode (LED) chip-based lighting product, comprising:
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mounting a plurality of unpackaged LED chips directly on conductors formed on a first surface of a two-sided panel that includes a second surface counterfacing the first surface; integrating the panel with support structure to form the lighting product such that at least part of the second surface forms an external surface of the lighting product; and coupling a diffuser with the support structure, with a distance from the diffuser to the surface of the LED chips being at least twice an average spacing between adjacent ones of the LED chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of building a light-emitting diode (LED) based lighting product, comprising:
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mounting a plurality of LEDs directly on conductors formed on a first surface of a two-sided panel that includes a second surface counterfacing the first surface; integrating the panel with support structure to form the lighting product such that at least part of the second surface forms an external surface of the lighting product; and coupling a diffuser with the support structure such that a distance from the diffuser to the surface of the LEDs is at least twice an average spacing between adjacent ones of the LEDs.
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16. A method of building a light-emitting diode (LED) chip-based lighting product, comprising:
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mounting a plurality of unpackaged LED chips directly on one or more first conductors formed on a first surface of a two-sided panel that includes a second surface counterfacing the first surface, the first surface of the panel also having one or more second conductors formed thereon, wherein mounting the cover plate comprises (a) mounting the cover plate having third conductors formed thereon, and (b) forming electrical connections between top sides of one or more of the LED chips and the second conductors, by connecting the top sides of the LED chips with the third conductors and connecting the second conductors with the third conductors; and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.
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17. A method of building a light-emitting diode (LED) chip-based lighting product, comprising:
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mounting a plurality of unpackaged LED chips directly on one or more first conductors formed on a first surface of a two-sided panel that includes a second surface counterfacing the first surface, the first surface of the panel also having one or more second conductors formed thereon; mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate; and positioning one or more reflectors between the first surface and the cover plate such that a portion of light emitted by the LED chips is reflected by the one or more reflectors through the cover plate. - View Dependent Claims (18)
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19. A method of building a light-emitting diode (LED) chip-based lighting product, comprising:
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mounting a plurality of unpackaged LED chips directly on conductors formed on a first surface of a two-sided panel that includes a second surface counterfacing the first surface, each of the LED chips being between 0.25 mm2 and 4mm2 in area, the unpackaged LED chips dissipating power of 6 to 10 Watts per square foot of area of the panel; and integrating the panel with support structure to form the lighting product such that at least part of the second surface forms an external surface of the lighting product.
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Specification