Solid state light sheet for general illumination having substrates for creating series connection of dies
First Claim
1. A lighting device comprising:
- a base substrate comprising an indented surface and a base surface opposing the indented surface, wherein the indented surface comprises a plurality of indentations, the indentations being spaced apart from one another;
a cover substrate comprising a light emitting surface and a cover surface, the cover surface of the cover substrate being in contact with the indented surface of the base substrate;
a plurality of non-packaged light emitting diode (LED) dies being disposed between the base substrate and the cover substrate and in respective indentations such that during operation of the lighting device a peak intensity of light emitted by the non-packaged LED dies is output through the light emitting surface of the cover substrate in a first direction; and
a first set of conductors and a second set of conductors configured to provide power to the non-packaged LED dies, where the non-packaged LED dies are connected to the first set of conductors and the second set of conductors without wires, and the first set of conductors is formed on the indented surface of the base substrate and the second set of conductors is formed on the cover surface of the cover substrate, wherein at least a first portion of the first set of conductors are physically connected to at least a first portion of the second set of conductors.
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Accused Products
Abstract
A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
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Citations
14 Claims
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1. A lighting device comprising:
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a base substrate comprising an indented surface and a base surface opposing the indented surface, wherein the indented surface comprises a plurality of indentations, the indentations being spaced apart from one another; a cover substrate comprising a light emitting surface and a cover surface, the cover surface of the cover substrate being in contact with the indented surface of the base substrate; a plurality of non-packaged light emitting diode (LED) dies being disposed between the base substrate and the cover substrate and in respective indentations such that during operation of the lighting device a peak intensity of light emitted by the non-packaged LED dies is output through the light emitting surface of the cover substrate in a first direction; and a first set of conductors and a second set of conductors configured to provide power to the non-packaged LED dies, where the non-packaged LED dies are connected to the first set of conductors and the second set of conductors without wires, and the first set of conductors is formed on the indented surface of the base substrate and the second set of conductors is formed on the cover surface of the cover substrate, wherein at least a first portion of the first set of conductors are physically connected to at least a first portion of the second set of conductors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification