Solid state light sheet for general illumination having substrates for creating series connection of dies

• US 8,338,839 B2
• Filed: 04/04/2011
• Issued: 12/25/2012
• Est. Priority Date: 08/27/2010
• Status: Active Grant

• Current Assignee: Quarkstar LLC
• Original Assignee: Quarkstar LLC
• Inventors: Lerman, Louis, York, Allan Brent, Henry, Michael David, Steele, Robert, Ogonowsky, Brian D.
• Primary Examiner(s): Li, Meiya
• Application Number:
  US13/079,706
• Publication Number:
  US 20110193105A1
• Time in Patent Office: 631 Days
• Field of Search: 257 80- 82, 257/88, 257/89, 257/95, 257 98-100, 257/E33.056, 257/E33.061, 438/25, 438/28, 438/34, 438/FOR.157, 438/FOR.287, 438/FOR.46, 362/217.01, 362/249.02, 362/311.02, 362/363, 362/545, 362/555, 362611-613, 362/800, 313/483, 313498-502
• US Class Current: 257/88
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21S 8/06 by suspension
• CPC Class Codes: F21Y 2107/90 on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence

Abstract

A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.

Claims

1. A lighting device comprising:

a base substrate comprising an indented surface and a base surface opposing the indented surface, wherein the indented surface comprises a plurality of indentations, the indentations being spaced apart from one another;

a cover substrate comprising a light emitting surface and a cover surface, the cover surface of the cover substrate being in contact with the indented surface of the base substrate;

a plurality of non-packaged light emitting diode (LED) dies being disposed between the base substrate and the cover substrate and in respective indentations such that during operation of the lighting device a peak intensity of light emitted by the non-packaged LED dies is output through the light emitting surface of the cover substrate in a first direction; and

a first set of conductors and a second set of conductors configured to provide power to the non-packaged LED dies, where the non-packaged LED dies are connected to the first set of conductors and the second set of conductors without wires, and the first set of conductors is formed on the indented surface of the base substrate and the second set of conductors is formed on the cover surface of the cover substrate, wherein at least a first portion of the first set of conductors are physically connected to at least a first portion of the second set of conductors.

2. The device of claim 1 wherein the plurality of non-packaged LED dies are vertical diodes, each vertical diode having a first die electrode on a first surface and a second die electrode on an opposite surface, wherein at least a second portion of the first set of conductors are connected to the first die electrodes and at least a second portion of the second set of conductors are connected to the second die electrodes, such that the second portion of the first set of conductors and the second portion of the second set of conductors provide power to at least a portion of the plurality of non-packaged LED dies.

3. The device of claim 1 further comprising an encapsulant proximate to at least some of the plurality of non-packaged LED dies.

4. The device of claim 3 wherein the encapsulant substantially fills each indentation to encapsulate the non-packaged LED dies.

5. The device of claim 4 wherein the encapsulant further comprises a wavelength conversion material to create an alternative composition of light wavelengths.

6. The device of claim 5 wherein the wavelength conversion material comprises phosphor.

7. The device of claim 1 wherein at least a portion of a first edge of the base substrate and at least a portion of a second edge of the cover substrate are connected together so that the base substrate and the cover substrate are aligned when they are brought together for sandwiching the plurality of non-packaged LED dies between the base substrate and the cover substrate.

8. The device of claim 1 wherein the indented surface further comprises cavities, each cavity being adjacent to an edge of each indentation.

9. The device of claim 8 wherein each cavity is formed to receive excess encapsulant.

10. The device of claim 1 wherein the base surface of the base substrate further includes a reflective layer.

11. The device of claim 1 further comprising a sublayer, the sublayer being in contact with the base surface of the base substrate.

12. The device of claim 11 wherein the sublayer comprises a reflective surface.

13. The device of claim 1 wherein, during operation of the lighting device a second peak intensity of light emitted by the non-packaged LED dies is output through the base substrate in a second direction.

14. The device of claim 1 wherein some of the plurality of non-packaged LED dies are connected in series by the first set of conductors and the second set of conductors.