Solid state light sheet or strip having cavities formed in bottom substrate
First Claim
1. A lighting device comprising:
- a light strip, the light strip comprising;
a base substrate comprising a first surface and a second surface opposing the first surface, the base substrate being elongated along a longitudinal dimension of the light strip, where the longitudinal dimension of the light strip is greater than a transverse dimension of the light strip, and wherein the first surface comprises a plurality of indentations, the indentations being spaced apart from one another and distributed along the longitudinal dimension of the light strip;
a cover substrate comprising a rounded surface and a cover surface, the cover substrate being elongated along the longitudinal dimension of the light strip, the cover surface of the cover substrate being in contact with the first surface of the base substrate, and the rounded surface of the cover substrate having a rounded shape;
a plurality of non-packaged light emitting diode (LED) dies being disposed between the base substrate and the cover substrate in respective indentations of the plurality of indentations such that during operation of the lighting device a peak intensity of light emitted by the plurality of non-packaged LED dies is output through the rounded surface of the cover substrate; and
a first set of conductors and a second set of conductors configured to provide power to the non-packaged LED dies, where the non-packaged LED dies are connected to the first set of conductors and the second set of conductors without wires, and the first set of conductors is formed on the first surface of the base substrate and the second set of conductors is formed on the cover surface of the cover substrate, wherein at least a first portion of the first set of conductors are physically connected to at least a first portion of the second set of conductors.
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Accused Products
Abstract
A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
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Citations
26 Claims
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1. A lighting device comprising:
a light strip, the light strip comprising; a base substrate comprising a first surface and a second surface opposing the first surface, the base substrate being elongated along a longitudinal dimension of the light strip, where the longitudinal dimension of the light strip is greater than a transverse dimension of the light strip, and wherein the first surface comprises a plurality of indentations, the indentations being spaced apart from one another and distributed along the longitudinal dimension of the light strip; a cover substrate comprising a rounded surface and a cover surface, the cover substrate being elongated along the longitudinal dimension of the light strip, the cover surface of the cover substrate being in contact with the first surface of the base substrate, and the rounded surface of the cover substrate having a rounded shape; a plurality of non-packaged light emitting diode (LED) dies being disposed between the base substrate and the cover substrate in respective indentations of the plurality of indentations such that during operation of the lighting device a peak intensity of light emitted by the plurality of non-packaged LED dies is output through the rounded surface of the cover substrate; and a first set of conductors and a second set of conductors configured to provide power to the non-packaged LED dies, where the non-packaged LED dies are connected to the first set of conductors and the second set of conductors without wires, and the first set of conductors is formed on the first surface of the base substrate and the second set of conductors is formed on the cover surface of the cover substrate, wherein at least a first portion of the first set of conductors are physically connected to at least a first portion of the second set of conductors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A lighting device comprising:
a light strip, the light strip comprising; a base substrate comprising a first surface and a second surface opposing the first surface, the base substrate being elongated along a longitudinal dimension of the light strip, where the longitudinal dimension of the light strip is greater than a transverse dimension of the light strip, and wherein the first surface comprises a groove along the longitudinal dimension of the light strip; a cover substrate comprising a rounded surface and a cover surface, the cover substrate being elongated along the longitudinal dimension of the light strip, the cover surface of the cover substrate being in contact with the first surface of the base substrate, and the rounded surface of the cover substrate having a rounded shape; a plurality of non-packaged light emitting diode (LED) dies being disposed spaced apart between the base substrate and the cover substrate in the groove such that during operation of the lighting device a peak intensity of light emitted by the plurality of non-packaged LED dies is output through the rounded cover surface of the cover substrate; and a first set of conductors and a second set of conductors configured to provide power to the non-packaged LED dies, where the non-packaged LED dies are connected to the first set of conductors and the second set of conductors without wires, and the first set of conductors is formed on the first surface of the base substrate and the second set of conductors is formed on the cover surface of the cover substrate, wherein at least a first portion of the first set of conductors are physically connected to at least a first portion of the second set of conductors. - View Dependent Claims (21, 22, 23, 24, 25, 26)
Specification