MEMS sensor, MEMS sensor manufacturing method, and electronic device
First Claim
1. A MEMS sensor comprising:
- a support portion;
a movable weight portion;
an elastically deformable connection portion connecting the support portion and the movable weight portion;
a fixed electrode portion extending from the support portion;
a movable electrode portion extending from the movable weight portion and disposed opposed to the fixed electrode portion; and
first through third adjusting layers, whereinthe first adjusting layer is provided at the movable weight portion, the second adjusting layer is provided at the fixed and movable electrode portions, and the third adjusting layer is provided at the elastically deformable connection portion.
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Accused Products
Abstract
A MEMS sensor formed by processing a multi-layer wiring structure, includes: a movable weight portion coupled to a fixed frame portion with an elastic deformable portion and having a hollow portion formed at the periphery; a capacitance electrode portion including a fixed electrode portion fixed to the fixed frame portion and a movable electrode portion connected to the movable weight portion and arranged to face the fixed electrode portion; and an adjusting layer for adjusting at least one of amass of the movable weight portion, a damping coefficient of the movable electrode portion, and spring characteristics in the elastic deformable portion, wherein the adjusting layer includes at least one insulating layer that is a constituent element of the multi-layer wiring structure.
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Citations
9 Claims
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1. A MEMS sensor comprising:
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a support portion; a movable weight portion; an elastically deformable connection portion connecting the support portion and the movable weight portion; a fixed electrode portion extending from the support portion; a movable electrode portion extending from the movable weight portion and disposed opposed to the fixed electrode portion; and first through third adjusting layers, wherein the first adjusting layer is provided at the movable weight portion, the second adjusting layer is provided at the fixed and movable electrode portions, and the third adjusting layer is provided at the elastically deformable connection portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A MEMS sensor manufacturing method for a MEMS sensor including a support portion;
- a movable weight portion;
an elastically deformable connection portion connecting the support portion and the movable weight portion;
a fixed electrode portion extending from the support portion; and
a movable electrode portion extending from the movable weight portion and disposed opposed to the fixed electrode portion, comprising;forming a laminated layer structure on a substrate; forming an adjusting layer at a top or bottom of the laminated layer structure; forming a first cavity portion from the top of the laminated layer structure to a surface of the substrate, by anisotropic etching; and isotropically etching the substrate via the first cavity portion to form a second cavity portion between the substrate and the laminated layer structure.
- a movable weight portion;
Specification