Integrated circuit with electromagnetic intrachip communication and methods for use therewith
First Claim
1. An integrated circuit comprising:
- a substrate;
a first integrated circuit die having a first circuit coupled to a first bonding pad on the substrate via a first bonding wire, the first circuit having a first intra-chip interface; and
a second integrated circuit die having a second circuit coupled to a second bonding pad on the substrate via a second bonding wire, the second circuit having a second intra-chip interface, the second bonding wire electrically isolated from the first bonding wire;
wherein the first circuit communicates with the second circuit via the first intra-chip interface and the second intra-chip interface, and wherein the first intra-chip interface and the second intra-chip interface communicate via a first electromagnetic coupling between the first bonding wire and the second bonding wire.
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Accused Products
Abstract
An integrated circuit includes a substrate and a first integrated circuit die having a first circuit coupled to the substrate via a first bonding wire, the first circuit having a first intra-chip interface. A second integrated circuit die has a second circuit coupled to the substrate via a second bonding wire, the second circuit having a second intra-chip interface, the second bonding wire electrically isolated from the first bonding wire. The first circuit communicates with the second circuit via the first intra-chip interface and the second intra-chip interface, and wherein the first intra-chip interface and the second intra-chip interface communicate via a first electromagnetic coupling between the first bonding wire and the second bonding wire.
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Citations
14 Claims
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1. An integrated circuit comprising:
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a substrate; a first integrated circuit die having a first circuit coupled to a first bonding pad on the substrate via a first bonding wire, the first circuit having a first intra-chip interface; and a second integrated circuit die having a second circuit coupled to a second bonding pad on the substrate via a second bonding wire, the second circuit having a second intra-chip interface, the second bonding wire electrically isolated from the first bonding wire; wherein the first circuit communicates with the second circuit via the first intra-chip interface and the second intra-chip interface, and wherein the first intra-chip interface and the second intra-chip interface communicate via a first electromagnetic coupling between the first bonding wire and the second bonding wire. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification