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Inductor element, inductor element manufacturing method, and semiconductor device with inductor element mounted thereon

  • US 8,339,230 B2
  • Filed: 08/01/2007
  • Issued: 12/25/2012
  • Est. Priority Date: 08/01/2006
  • Status: Active Grant
First Claim
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1. An inductor element formed in a multiple layer lead structure comprising:

  • a lead,an insulative layer that insulates leads above and below, anda via provided in the insulative layer and connecting leads above and below,wherein lead layers are multiply laminated layers, comprising at least a portion of at least a pair of vertically adjacent leads which are coiled leads;

    wherein the coiled leads are connected in series,wherein at least two of the coiled leads comprise a shape having one wind;

    wherein a shape having said one wind does not completely coil around and has a notch in a portion thereof;

    wherein current directions of vertically adjacent coiled leads are the same by a via provided on an end portion thereof, and form a serial inductance; and

    wherein an inter-lead capacitance of the vertically adjacent coiled leads is larger than an inter-lead capacitance between other coiled leads formed in the same lead layer.

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