Three dimensional inductor

• US 8,339,233 B2
• Filed: 05/18/2011
• Issued: 12/25/2012
• Est. Priority Date: 12/08/2010
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chen, Chang-Sheng, Chang, Li-Chi, Tsai, Cheng-Hua, Liu, Chang-Chih, Chang, Yung-Chung
• Primary Examiner(s): Musleh, Mohamad
• Assistant Examiner(s): BAISA, JOSELITO SASIS
• Application Number:
  US13/110,846
• Publication Number:
  US 20120146757A1
• Time in Patent Office: 587 Days
• Field of Search: 336/200, 336/223, 336/232
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 5/00 Coils superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00

Abstract

A three-dimensional inductor is provided. The three-dimensional inductor is disposed in a multi-layered substrate. The multi-layered substrate includes at least a dielectric layer and at least two metal layers. The three-dimensional inductor includes a first coil and a second coil. The second coil is electrically connected to the first coil. The first coil is on a first plane and formed on a first metal layer. The second coil is on a second plane and disposed in a variety of dielectric layers and metal layer. The first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other.

Claims

1. A three dimensional inductor, disposed in at least one substrate, wherein the substrate comprises at least one dielectric layer, a first conductive wire layer and a second conductive wire layer, the dielectric layer has a first surface and a second surface, the first conductive wire layer disposed on the first surface of the dielectric layer and the second conductive wire layer disposed on the second surface of the dielectric layer, comprising:

a first coil, located at a first plane, disposed in the first conductive wire layer;

a second coil, electrically connected to the first coil, located at a second plane, disposed in the dielectric layer and the second conductive wire layer; and

first and second external connection points;

wherein the first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other;

wherein a first lead is connected between the first coil and the first external connection point, and a second lead is connected between the second coil and the second external connection point;

wherein the second coil comprises a first via wire, a second via wire, a first metal wire, a first pad and a second pad; and

wherein the first via wire is connected between a third pad and the first pad, the second via wire is connected between a fourth pad and the second pad, the first metal wire is connected between the first pad and the second pad, the first coil and the second coil are connected at the third pad, the third pad is connected to the first lead via the first coil and the fourth pad is connected to the second lead.

2. The three dimensional inductor as claimed in claim 1, further comprising:

a first sub-coil, electrically connected to the second coil, located at the first plane, disposed in the first conductive wire layer.

3. The three dimensional inductor as claimed in claim 2, further comprising:

a second sub-coil, electrically connected to the first sub-coil, located at the second plane, disposed in the dielectric layer and the second conductive wire layer.

4. The three dimensional inductor as claimed in claim 3, wherein the first coil and the first sub-coil are at least one-fourth of a circle, and the first coil, the second coil, the first sub-coil and the second sub-coil are a polygon spiral coil or circular spiral coil.

5. The three dimensional inductor as claimed in claim 4, wherein the first metal wire disposed in the second conductive wire layer, and the first via wires penetrate through the dielectric layer and connect to the first metal wire;

and

the sub-coil comprises at least one second metal wire and two second via wires, and the second metal wire disposed at the second conductive wire layer, and the second via wires penetrate through the dielectric layer and connect to the second metal wire.

6. The three dimensional inductor as claimed in claim 1, further comprising:

a third coil, electrically connected to a coil, wherein the third coil located at a third plane, and disposed in the dielectric layer and each conductive wire layer, and the third plane is vertical to the first plane and parallel to the second plane.

7. The three dimensional inductor as claimed in claim 6, further comprising:

a fourth coil, electrically connected to a coil, wherein the fourth coil located at a fourth plane, and disposed in the dielectric layer and each conductive wire layer, wherein the fourth plane is vertical to the first plane, the second plane and the third plane.

8. The three dimensional inductor as claimed in claim 6, further comprising:

a first permeability material vertically disposed at the center of the first coil and a second permeability material vertically disposed at the centers of the second coil and the third coil.

9. The three dimensional inductor as claimed in claim 7, further comprising:

a first permeability material vertically disposed at the center of the first coil, a second permeability material vertically disposed at the centers of the second coil and the third coil, and a third permeability material vertically disposed at the center of the fourth coil.

10. The three dimensional inductor as claimed in claim 7, further comprising:

a fifth coil, electrically connected to a coil, wherein the fifth coil located at a fifth plane, and disposed in the dielectric layer and each conductive wire layer, and the fifth plane is parallel to the fourth plane, and the fifth plane is vertical to the first plane, the second plane and the third plane.

11. The three dimensional inductor as claimed in claim 10, further comprising:

a sixth coil, electrically connected to a coil, wherein the sixth coil located at a sixth plane, and disposed in the dielectric layer and the second conductive wire layer, and the sixth plane is parallel to the first plane, and is vertical to the second plane, the third plane, the fourth plane and the fifth plane.

12. The three dimensional inductors as claimed in claim 10, further comprising:

a first permeability material vertically disposed at the center of the first coil;

a second permeability material vertically disposed at the center of the second coil and the third coil; and

a third permeability material vertically disposed at the center of the fourth coil and the fifth coil.

13. The three dimensional inductor as claimed in claim 11, wherein the first coil, the second coil, the third coil, the fourth coil, the fifth coil and the sixth coil are at least a circular shaped, and are a polygon spiral coil, or circular spiral coil.

14. The three dimensional inductors as claimed in claim 11, further comprising:

a first permeability material vertically disposed at the center of the first coil and the sixth coil;

a second permeability material vertically disposed at the center of the second coil and the third coil; and

a third permeability material vertically disposed at the center of the fourth coil and the fifth coil.

15. The three dimensional inductor as claimed in claim 13, wherein the second coil, the third coil, the fourth coil, and the fifth coil formed a coil by combining at least one metal wire and two via wires together, wherein the metal wire disposed in the second conductive wire layer, and the two via wire penetrates through the dielectric layer from the first conductive wire layer to the second conductive wire layer to connect the metal wire.

16. The three dimensional inductor as claimed in claim 15, wherein one coil connected to another coil by a connection via or a connection wire.

17. The three dimensional inductor as claimed in claim 1, wherein the dielectric layer is made of high dielectric constant materials, low dielectric constant materials or permeability materials, and the permeability of the permeability materials is higher than 1.

18. The three dimensional inductor as claimed in claim 1, adapted to Printed Circuit Board (PCB) manufacturing, Low Temperature Co-fired Ceramic (LTCC) manufacturing, Integrated Circuit manufacturing, thin film manufacturing, thick film manufacturing and any other embedded inductor manufacturing.

19. The three dimensional inductor as claimed in claim 1, further comprising:

a first permeability material vertically disposed at the center of the first coil, and a second permeability material vertically disposed at the center of the second coil.