Power capacitor

• US 8,339,767 B2
• Filed: 04/13/2006
• Issued: 12/25/2012
• Est. Priority Date: 05/02/2005
• Status: Active Grant

• Current Assignee: TDK Electronics AG (TDK Corporation)
• Original Assignee: Epcos AG (TDK Corporation)
• Inventors: Grimm, Wilhelm, Hübscher, Wilhelm, Vetter, Harald
• Primary Examiner(s): Ha, Nguyen T
• Application Number:
  US11/913,397
• Publication Number:
  US 20090195957A1
• Time in Patent Office: 2,448 Days
• Field of Search: 361/311, 361303-305, 361/306.2, 361328-330, 361312-313, 361/502, 361/301.2, 361/301.5, 361/306.1
• US Class Current: 361/311
• CPC Class Codes: H01G 2/106 Fixing the capacitor in a housing
• CPC Class Codes: H01G 9/06 Mounting in containers
• CPC Class Codes: H01G 9/08 Housing; Encapsulation

Abstract

A power capacitor is described herein. The power capacitor includes a housing and at least one capacitor winding. The power capacitor also includes at least one mechanical spring element between the housing and the at least one capacitor winding.

Claims

1. A module for power electronics, comprising:

a capacitor comprising a trough-shaped housing and at least one capacitor winding;

at least one mechanical spring element on a base of the housing; and

an electrical unit having a base region;

wherein the capacitor is mounted on the base region of the electrical unit; and

wherein the spring element is configured to press the at least one capacitor winding onto the base region of the electrical unit.

2. The module of claim 1, wherein the at least one mechanical spring element comprises a spring element on each of two opposing sides of the at least one capacitor winding.

3. The module of claim 1, further comprising a profiled insulating shell between the at least one capacitor winding and the housing holding the spring element.

4. The module of claim 1, further comprising a cooling plate in thermal contact with a cooling surface of the capacitor formed by a current rail on the base of the electrical unit.

5. The module of claim 4, further comprising an electrical insulating film on a side of the cooling surface facing the electrical unit.

6. The module of claim 1, further comprising IGBTs.

7. The module of claim 1, wherein the at least one mechanical spring element comprises a spring pad.

8. The module of claim 1, wherein the spring pad comprises plastic foam.

9. The module of claim 8, wherein the plastic foam comprises pores that define gas-tight enclosed cells, the gas-tight enclosed cells storing gas.