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Module having a stacked magnetic device and semiconductor device and method of forming the same

  • US 8,339,802 B2
  • Filed: 02/26/2009
  • Issued: 12/25/2012
  • Est. Priority Date: 10/02/2008
  • Status: Active Grant
First Claim
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1. A module, comprising:

  • a printed wiring board including a spirally shaped patterned conductor formed on an upper surface of said printed wiring board coupled to another spirally shaped patterned conductor with a same winding sense on a lower surface of said printed wiring board;

    a magnetic core mounted on said upper surface of said printed wiring board proximate said patterned conductor; and

    a semiconductor device mounted on an upper surface of said magnetic core.

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