Three-dimensional system and method for connection component labeling
First Claim
Patent Images
1. A method for three dimensional connected component labeling, the method comprising:
- a. determining a location value for each of one or more labels, each location value identifying a maximum “
y”
extent and a maximum “
z”
extent of an associated label region;
b. storing each of the one or more labels that refer to areas subsumed in a determination of the maximum y extent in the maximum “
z”
extent as a yzMax location value;
c. buffering in a frame buffer the one or more of labels; and
providing access via a three-dimensional kernel to one or more values in a current line buffer and/or a current array and/or a previous array.
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Abstract
Embodiments disclosed include methods and systems for three dimensional connected component labeling, including determining a location value for each of one or more labels, each location value identifying a maximum “y” extent and a maximum “z” extent of an associated label region; storing each of the one or more labels that refer to areas subsumed in a determination of the maximum y extent in the maximum “z” extent as a yzMax location value; buffering in a frame buffer the one or more of labels; and providing access via a three-dimensional kernel to one or more values in a current line buffer and/or a current array and/or a previous array.
14 Citations
20 Claims
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1. A method for three dimensional connected component labeling, the method comprising:
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a. determining a location value for each of one or more labels, each location value identifying a maximum “
y”
extent and a maximum “
z”
extent of an associated label region;b. storing each of the one or more labels that refer to areas subsumed in a determination of the maximum y extent in the maximum “
z”
extent as a yzMax location value;c. buffering in a frame buffer the one or more of labels; and
providing access via a three-dimensional kernel to one or more values in a current line buffer and/or a current array and/or a previous array. - View Dependent Claims (2, 3, 4, 5)
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6. A computer program product comprising a non-transitory computer readable medium configured to perform one or more acts for performing three dimensional labeling of one or more labels the one or more acts comprising:
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a. one or more instructions for determining a location value for each of one or more labels, each location value identifying a maximum “
y”
extent and a maximum “
z”
extent of an associated label region;b. one or more instructions for storing each of the one or more labels that refer to areas subsumed in a determination of the maximum y extent and maximum z extent as a yzMax location value; c. one or more instructions for buffering in a frame buffer the one or more of labels; and d. one or more instructions for providing access via a three-dimensional kernel to one or more values in a current line buffer and/or a current array and/or a previous array. - View Dependent Claims (7, 8, 9, 10)
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11. A method for a three dimensional kernel for performing connected component labeling, the method comprising:
- accessing one or more values located in corresponding locations in a first two-dimensional array and a second two-dimensional array;
performing kernel operations on one or more successive array locations in each of the first and second two-dimensional arrays; and
comparing the one or more accessed values to determine one or more relationships for three-dimensional connected component labeling. - View Dependent Claims (12, 13, 14, 15)
- accessing one or more values located in corresponding locations in a first two-dimensional array and a second two-dimensional array;
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16. A computer program product comprising a non-transitory computer readable medium configured to perform one or more acts for a three dimensional kernel for three dimensional connected component labeling, the one or more acts comprising:
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a. one or more instructions for accessing one or more values located in corresponding locations in a first two-dimensional array and a second two-dimensional array; b. one or more instructions for performing kernel operations on one or more successive array locations in each of the first and second two-dimensional arrays; and c. one or more instructions for comparing the one or more accessed values to determine one or more relationships for three-dimensional connected component labeling. - View Dependent Claims (17, 18, 19, 20)
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Specification