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Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method

  • US 8,340,803 B2
  • Filed: 06/17/2009
  • Issued: 12/25/2012
  • Est. Priority Date: 09/22/2008
  • Status: Active Grant
First Claim
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1. A component placement apparatus which allows multiple placement heads to operate to pick up components from a pallet and to operate to place the components on a circuit board arranged in one direction with respect to the pallet during one operation, wherein,the component placement apparatus comprises a controller to perform a processing, during the one operation that the multiple placement heads, each of which moves in a different area, pick up the components from the pallet and place the components on the circuit board, for specifying a pair of component groups to be picked up from the pallet by the multiple placement heads so that an area where the multiple placement heads move in an overlapping manner is minimized, andthe processing for allowing each of the placement heads to operate to pick up the components included respectively in the component groups forming the pair, and to operate to place the components being picked up on the circuit board.

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