Wireless IC device, wireless IC module and method of manufacturing wireless IC module

• US 8,342,416 B2
• Filed: 06/27/2011
• Issued: 01/01/2013
• Est. Priority Date: 01/09/2009
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru
• Primary Examiner(s): VO, TUYEN KIM
• Application Number:
  US13/169,067
• Publication Number:
  US 20110253795A1
• Time in Patent Office: 554 Days
• Field of Search: 235/375, 235/451, 235/492, 340/572.1, 340/572.7
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01Q 1/22 by structural association with other equipment or articles
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A wireless IC module that can function as a component of an RFID system even when mounted on a metal article includes a loop-shaped electrode that is constructed such that a plane of a loop of the loop-shaped electrode is substantially perpendicular to the mounting surface of a wireless IC module. The loop-shaped electrode functions as a magnetic field antenna and is electromagnetically coupled with a metal article so that the surface of the metal article functions as a radiator antenna.

Claims

1. A wireless IC device comprising:

a wireless IC that processes radio signals;

a radiation electrode that defines a radiating member; and

a plurality of loop-shaped electrodes each including a plurality of perpendicular electrode portions that are perpendicular or substantially perpendicular to a plane of the radiation electrode, each of said plurality of loop-shaped electrodes having a loop shape defined by an electrode including the perpendicular electrode portions, and said plurality of loop-shaped electrodes being coupled with the wireless IC and the radiation electrode;

wherein

the plurality of loop-shaped electrodes are connected in parallel with one another;

the wireless IC and the plurality of loop-shaped electrodes define a wireless IC module;

the plurality of loop-shaped electrodes includes a common electrode that is commonly connected to all others of the plurality of loop-shaped electrodes; and

the common electrode is located on a mounting surface of the wireless IC module.

2. The wireless IC device according to claim 1, wherein each of the plurality of loop-shaped electrodes includes at least four of the plurality of perpendicular electrode portions.

3. The wireless IC device according to claim 1, wherein the radiation electrode is disposed so as to extend across a position facing at least one of the plurality of loop-shaped electrodes.

4. The wireless IC device according to claim 1, wherein at least one of the plurality of loop-shaped electrodes is electrically conductive with the radiation electrode and a portion of the radiation electrode doubles as the at least one of the plurality of loop-shaped electrodes.

5. A wireless IC module comprising:

a wireless IC that processes predetermined radio signals; and

a plurality of loop-shaped electrodes that are coupled with the wireless IC;

wherein

each of the plurality of loop-shaped electrodes includes a plurality of perpendicular electrode portions that are perpendicular or substantially perpendicular to a mounting surface of the wireless IC module;

the plurality of loop-shaped electrodes are connected in parallel with one another;

the plurality of loop-shaped electrodes includes a common electrode that is commonly connected to all others of the plurality of loop-shaped electrodes; and

the common electrode is located on the mounting surface of the wireless IC module.

6. The wireless IC module according to claim 5, wherein each of the plurality of loop-shaped electrodes includes at least four of the plurality of perpendicular electrode portions.

7. The wireless IC module according to claim 5, further comprising a board, wherein at least one of the plurality of loop-shaped electrodes is located on the board.

8. The wireless IC module according to claim 7, wherein the at least one of the plurality of loop-shaped electrodes includes a via hole conductor that extends through the board.

9. The wireless IC module according to claim 5, wherein at least one of the plurality of loop-shaped electrode is defined by capacitive coupling.

10. A method of manufacturing a wireless IC module including a wireless IC that processes predetermined radio signals and a plurality of loop-shaped electrodes that are coupled with the wireless IC, the method comprising:

a step of preparing a metal plate that has been patterned to form a line-shaped electrode;

a step of forming the plurality of loop-shaped electrodes each including a plurality of perpendicular electrode portions that are perpendicular or substantially perpendicular to a mounting surface of the wireless IC module by folding and wrapping the metal plate around a board; and

a step of connecting the plurality of loop-shaped electrodes in parallel with one another;

wherein

the step of forming the plurality of loop-shaped electrodes includes forming a common electrode that is commonly connected to all others of the plurality of loop-shaped electrodes on the mounting surface of the wireless IC module.

11. A method of manufacturing a wireless IC module including a wireless IC that processes predetermined radio signals, and a plurality of loop-shaped electrodes that are coupled with the wireless IC, the method comprising:

a step of preparing a metal plate that has been patterned to form a line-shaped electrode;

a step of forming the plurality of loop-shaped electrodes each including a plurality of perpendicular electrode portions that are perpendicular or substantially perpendicular to a mounting surface of the wireless IC module by folding and wrapping the metal plate around a board;

a step of connecting the plurality of loop-shaped electrodes in parallel with one another; and

a step of subjecting the folded metal plate to molding using a resin;

wherein

the step of forming the plurality of loop-shaped electrodes includes forming a common electrode that is commonly connected to all others of the plurality of loop-shaped electrodes on the mounting surface of the wireless IC module.