Method and structure for dividing a substrate into individual devices
First Claim
1. A method for obtaining an individual device from a semiconductor structure that includes a device layer formed on a substrate, the device layer including a plurality of devices separated by respective predefined spacings, the method comprising:
- forming a vertically extending structure on a backside surface of the substrate, the vertically extending structure being aligned with the respective predefined spacings of the individual device, the vertically extending structure forming an opening on the backside surface of the substrate that is aligned with the individual device;
forming a metal layer in the opening; and
cutting through the vertically extending structure to separate the individual device from the substrate.
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Abstract
A method for obtaining individual dies from a semiconductor structure is disclosed. The semiconductor structure includes a device layer, and the device layer in turn includes active regions separated by predefined spacings. Thick metal is selectively formed on backside of the device layer such that thick metal is formed on backside of active regions but not on backside of the predefined spacings. The semiconductor structure is then cut along the predefined spacings to separate the active regions with thick metal on their backside into individual dies.
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Citations
15 Claims
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1. A method for obtaining an individual device from a semiconductor structure that includes a device layer formed on a substrate, the device layer including a plurality of devices separated by respective predefined spacings, the method comprising:
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forming a vertically extending structure on a backside surface of the substrate, the vertically extending structure being aligned with the respective predefined spacings of the individual device, the vertically extending structure forming an opening on the backside surface of the substrate that is aligned with the individual device; forming a metal layer in the opening; and cutting through the vertically extending structure to separate the individual device from the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for separating an individual device from a semiconductor structure that includes a device layer formed on a substrate, the device layer including a plurality of devices separated by respective predefined spacings, the method comprising:
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forming a metal layer on a backside surface of the substrate; using a masking layer, removing a portion of the metal layer so that a corresponding portion of the backside surface of the substrate is exposed, the exposed portion of the backside surface of the substrate being aligned with the respective predefined spacings of the individual device, such that an island of the metal layer that is aligned with the individual device remains on the backside surface of the substrate; and after removing the portion of the metal layer, cutting the semiconductor structure along the exposed portion of the backside surface of the substrate to separate the individual device. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification