Method and structure for thin film photovoltaic cell using similar material junction
First Claim
1. A method for forming a thin film photovoltaic device comprising:
- providing a transparent substrate having a surface;
forming a first electrode layer over the surface;
depositing a barrier layer over the first electrode layer to protect the first electrode layer from contamination;
forming a copper layer over the barrier layer;
forming an indium layer over the copper layer to form a multi-layered structure comprising the copper layer and the indium layer;
subjecting the multi-layered structure to a thermal treatment process in an environment containing a sulfur bearing species to thereby form bulk copper indium disulfide material, the bulk copper indium disulfide material comprising a copper poor surface region with n-type impurity characteristic, wherein the copper poor surface region comprises a copper to indium atomic ratio of less than about 0.95;
1;
exposing the bulk copper indium disulfide material to an aluminum species to form a p-type copper indium aluminum disulfide material;
forming a high resistivity transparent material over the copper indium aluminum disulfide material; and
forming a second electrode layer having a p-type impurity characteristic over the high resistivity transparent layer.
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Abstract
A method for forming a thin film photovoltaic device. The method provides a transparent substrate including a surface region. A first electrode layer overlies the surface region. A copper layer is formed overlying the first electrode layer and an indium layer is formed overlying the copper layer to form a multi-layered structure. At least the multi-layered structure is subjected to a thermal treatment process in an environment containing a sulfur bearing species to forming a bulk copper indium disulfide. The bulk copper indium disulfide material has a surface region characterized by a copper poor surface region having a copper to indium atomic ratio of less than about 0.95:1 and n-type impurity characteristics. The bulk copper indium disulfide material excluding the copper poor surface region forms an absorber region and the copper poor surface region forms at least a portion of a window region for the thin film photovoltaic device. The method optionally forms a high resistivity transparent material having an intrinsic semiconductor characteristic overlying the copper poor surface region. A second electrode layer overlies the high resistivity transparent layer.
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Citations
11 Claims
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1. A method for forming a thin film photovoltaic device comprising:
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providing a transparent substrate having a surface; forming a first electrode layer over the surface; depositing a barrier layer over the first electrode layer to protect the first electrode layer from contamination; forming a copper layer over the barrier layer; forming an indium layer over the copper layer to form a multi-layered structure comprising the copper layer and the indium layer; subjecting the multi-layered structure to a thermal treatment process in an environment containing a sulfur bearing species to thereby form bulk copper indium disulfide material, the bulk copper indium disulfide material comprising a copper poor surface region with n-type impurity characteristic, wherein the copper poor surface region comprises a copper to indium atomic ratio of less than about 0.95;
1;exposing the bulk copper indium disulfide material to an aluminum species to form a p-type copper indium aluminum disulfide material; forming a high resistivity transparent material over the copper indium aluminum disulfide material; and forming a second electrode layer having a p-type impurity characteristic over the high resistivity transparent layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification