Test module for radio frequency identification chips and method of the same

• US 8,344,734 B2
• Filed: 10/06/2009
• Issued: 01/01/2013
• Est. Priority Date: 10/09/2008
• Status: Expired due to Fees

• Current Assignee: Mutual-Pak Technology Co., Ltd. (Taiwan Semiconductor Manufacturing Company Limited)
• Original Assignee: Mutual-Pak Technology Co., Ltd. (Taiwan Semiconductor Manufacturing Company Limited)
• Inventors: Hwan, Lu-Chen
• Primary Examiner(s): VALONE, THOMAS F
• Application Number:
  US12/574,372
• Publication Number:
  US 20100090707A1
• Time in Patent Office: 1,183 Days
• Field of Search: 324/537
• US Class Current: 324/537
• CPC Class Codes: G01R 31/2822 of microwave or radiofrequency circuits of attenuation, gain, e.g. using network analyzers G01R27/28

Abstract

A test module and method for radio frequency identification (RFID) chips are provided. The test module includes a test head having a chip carrier for carrying a RFID chip to be tested, the chip carrier having a first antenna electronically connecting the RFID chip. The module further includes a second antenna for communicating with the first antenna; and a base supporting the chip carrier and the second antenna. The test module further includes a test computer electronically connecting the second antenna, wherein the test computer evaluates functions of the RFID chip by way of the communications between the first antenna and the second antenna.

Claims

1. A test module for radio frequency identification (RFID) chips, comprising:

a chip carrier for carrying a RFID chip to be tested, wherein the chip carrier comprises;

a first antenna;

a connector above the first antenna, the connector having a carrier supporting the RFID chip and a plurality of metal wires respectively passing through the carrier so as to electronically connect the first antenna to the RFID chip; and

a shell enclosing the connector, wherein the shell has an opening exposing a portion of the connector and the RFID chip is received in the opening; and

a second antenna for communicating with the first antenna;

a base supporting the chip carrier and the second antenna; and

a test computer electronically connecting the second antenna, wherein the test computer evaluates functions of the RFID chip by way of the communications between the first antenna and the second antenna, and wherein each metal wire has two exposed ends electrically connecting the first antenna and the RFID chip, respectively, and each metal wire is uniformly arranged in the carrier with a distance from 30 μ

m to 50 μ

m between each other.

2. The test module for the RFID chips of claim 1, wherein materials of the carrier comprise silicone or polyurethane.

3. The test module for the RFID chips of claim 1, further comprising:

an isolation member on the base, isolating the first antenna from the second antenna.

4. The test module for the RFID chips of claim 1, wherein the test computer is used to write data into/read or erase data from the RFID chip.

5. The test module for the RFID chips of claim 1, further comprising:

a chip transport device for transferring the RFID chip to the chip carrier.

6. The test module for the RFID chips of claim 5, wherein the chip transport device further comprises a vibration plate and a conveyor belt connecting the vibration plate, and wherein the vibration plate transfers the RFID chips to the conveyor belt one by one.