Semiconductor device

• US 8,344,888 B2
• Filed: 08/24/2007
• Issued: 01/01/2013
• Est. Priority Date: 08/31/2006
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Osada, Takeshi, Tamura, Hikaru
• Primary Examiner(s): Wu, Daniel
• Assistant Examiner(s): POINT, RUFUS C
• Application Number:
  US11/892,568
• Publication Number:
  US 20080055047A1
• Time in Patent Office: 1,957 Days
• Field of Search: 340/572.7, 340/572.4, 340/10.34, 340/10.33, 340/572.1
• US Class Current: 340/572.7
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 21/28 Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00
• CPC Class Codes: H04B 5/00 Near-field transmission systems, e.g. inductive or capacitive transmission systems
• CPC Class Codes: H04B 5/26 using coils
• CPC Class Codes: H04B 5/77 for interrogation

Abstract

The semiconductor device includes a signal processing circuit, an antenna circuit that is connected to the signal processing circuit, and a storage means that supplies electric power to the signal processing circuit. The signal processing circuit receives and transmits information through the antenna circuit, generates a direct current voltage from signals received by the antenna circuit, and stores the direct current voltage in the storage means. Furthermore, the antenna circuit has an antenna portion that receives signals by an electromagnetic induction method and an antenna portion that receives signals by a microwave method so that signals of frequencies from a wide band can be received. Because signals from a wide band can be received, the environment in which the storage means can be charged is widened.

Claims

1. A semiconductor device comprising:

a signal processing circuit;

a first antenna and a second antenna which are electrically connected to the signal processing circuit,

wherein the first antenna and the second antenna are electrically connected to a common antenna terminal and the signal processing circuit is electrically connected to the antenna terminal; and

a storage device for supplying electric power to the signal processing circuit,

wherein the first antenna is configured to receive a signal by an electromagnetic induction method or an electromagnetic coupling method using a coil-shaped conductor;

wherein the second antenna is configured to receive a signal by a microwave method using a conductor formed of a right triangle conductor and a first linear conductor, which are connected to each other, and a second linear conductor that is connected to said common antenna terminal;

wherein the signal processing circuit is configured to receive and transmit information via the first antenna,

wherein the signal processing circuit is configured to receive and transmit information via the second antenna; and

wherein the signal processing circuit is configured to generate a direct current voltage from the signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage.

4. The semiconductor device according to claim 1, wherein the storage device is a secondary battery.

7. The semiconductor device according to claim 1, wherein the storage device is a capacitor.

2. A semiconductor device comprising:

a signal processing circuit comprising a power section and a logic section;

a first antenna and a second antenna which are electrically connected to the power section and the logic section,

wherein the first antenna and the second antenna are electrically connected to a common antenna terminal and the signal processing circuit is electrically connected to the antenna terminal;

a storage device for supplying electric power to the signal processing circuit,

wherein the logic section is configured to receive and transmit information via the first antenna,

wherein the logic section is configured to receive and transmit information via the second antenna; and

wherein the power section is configured to generate a direct current voltage from signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage,

wherein the first antenna is configured to receive a signal by an electromagnetic induction method or an electromagnetic coupling method using a coil-shaped conductor; and

wherein the second antenna is configured to receive a signal by a microwave method using a conductor formed of a right triangle conductor and a first linear conductor, which are connected to each other, and a second linear conductor that is connected to said common antenna terminal.

5. The semiconductor device according to claim 2, wherein the storage device is a secondary battery.

8. The semiconductor device according to claim 2, wherein the storage device is a capacitor.

3. A semiconductor device comprising:

a signal processing circuit comprising a power section and a logic section;

a first antenna and a second antenna which are electrically connected to the power section and the logic section,

wherein the first antenna and the second antenna are electrically connected to a common antenna terminal and the signal processing circuit is electrically connected to the antenna terminal;

a storage device for supplying electric power to the signal processing circuit,

wherein the logic section is configured to receive and transmit information via the first antenna;

wherein the logic section is configured to receive and transmit information via the second antenna;

wherein the power section generates a direct current voltage from signals received by the first antenna and the second antenna and the storage device is charged up by the direct current voltage;

wherein a frequency of a signal received by the first antenna and a frequency of a signal received by the second antenna are different

wherein the first antenna is configured to receive a signal by an electromagnetic induction method or an electromagnetic coupling method using a coil-shaped conductor; and

wherein the second antenna is configured to receive a signal by a microwave method using a conductor formed of a right triangle conductor and a first linear conductor, which are connected to each other, and a second linear conductor that is connected to said common antenna terminal.

6. The semiconductor device according to claim 3, wherein the storage device is a secondary battery.

9. The semiconductor device according to claim 3, wherein the storage device is a capacitor.