Method for fabricating a carrier with a three dimensional inductor

• US 8,347,490 B1
• Filed: 06/30/2011
• Issued: 01/08/2013
• Est. Priority Date: 06/30/2011
• Status: Active Grant

• Current Assignee: Chipbond Technology Corporation
• Original Assignee: Chipbond Technology Corporation
• Inventors: Kuo, Chih-Ming, Hsu, You-Ming
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US13/173,022
• Publication Number:
  US 20130002387A1
• Time in Patent Office: 558 Days
• Field of Search: 296/021, 29604-607, 298/29, 298/32, 336/178, 336/200, 336/212, 336/223, 336/232
• US Class Current: 29/605
• CPC Class Codes: H01F 5/00 Coils superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/097 Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
• CPC Class Codes: H05K 3/465 by applying an insulating layer having channels for the next circuit layer
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots.

Claims

1. A method for fabricating a carrier with a three dimensional inductor comprises the steps of:

providing a substrate having a surface, at least one first bond pad and a protective layer, wherein the at least one first bond pad is disposed on the surface of the substrate, the protective layer is formed on the surface of the substrate and comprises at least one first opening, a first disposing zone and a plurality of second disposing zones, the at least one first bond pad is exposed by the first opening, and the first opening is located at the first disposing zone;

forming a first photoresist layer on the protective layer;

patterning the first photoresist layer to form at least one second opening and a plurality of first disposing slots, the first disposing zone is exposed by the at least one second opening, and the second disposing zones are exposed by the first disposing slots;

forming a first metal layer within the at least one second opening and the first disposing slots and enabling the first metal layer to form a first connecting pad and a plurality of first inductive portions, and each of the first inductive portions comprises a first connecting terminal, a second connecting terminal and a first height;

removing the first photoresist layer;

forming a first dielectric layer on the protective layer and covering the first metal layer with the first dielectric layer, wherein the first dielectric layer comprises a third opening, a plurality of fourth openings and a plurality of fifth openings, the first connecting pad is exposed by the third opening, each of the first connecting terminals is exposed by each of the fourth openings, and each of the second connecting terminals is exposed by each of the fifth openings;

forming a second photoresist layer on the first dielectric layer;

patterning the second photoresist layer to form a second disposing slot, a plurality of third disposing slots and a plurality of fourth disposing slots, the first connecting pad is exposed by the second disposing slot, each of the first connecting terminals is exposed by each of the third disposing slots, and each of the second connecting terminals is exposed by each of the fourth disposing slots;

forming a second metal layer within the second disposing slot, the third disposing slots and the fourth disposing slots and enabling the second metal layer to form a second inductive portion, a plurality of third inductive portions and a plurality of fourth inductive portions, wherein the second inductive portion is in connection with the first connecting pad and comprises a first top surface and a second height, each of the third inductive portions is in connection with each of the second connecting terminals and comprises a second top surface and a third height, each of the fourth inductive portions is in connection with each of the first connecting terminals and comprises a third top surface and a fourth height, wherein the dimension of the first height is smaller than that of the second height, the third height and the fourth height;

removing the second photoresist layer;

forming a second dielectric layer on the first dielectric layer and covering the second metal layer with the second dielectric layer, the second dielectric layer comprises a first exposing slot, a plurality of second exposing slots and a plurality of third exposing slots, the first top surface is exposed by the first exposing slot, each of the second top surfaces is exposed by each of the second exposing slots, and each of the third top surfaces is exposed by each of the third exposing slots;

forming a third photoresist layer on the second dielectric layer;

patterning the third photoresist layer to form a fifth disposing slot and a plurality of sixth disposing slots, the first top surface and the second top surface are exposed by the fifth disposing slot, each of the second top surfaces and each of the third top surfaces are exposed by each of the sixth disposing slots; and

forming a third metal layer in the fifth disposing slot and the sixth disposing slots and enabling the third metal layer to form a fifth inductive portion and a plurality of sixth inductive portions, the fifth inductive portion is in connection with the second inductive portion and the third inductive portion, each of the sixth inductive portions is in connection with the third inductive portion and the fourth inductive portion, the fifth inductive portion comprises a fifth height, each of the sixth inductive portions comprises a sixth height, wherein the dimension of the fifth height and the sixth height are respectively smaller than that of the second height, the third height and the fourth height.

2. The method for fabricating a carrier with a three dimensional inductor in accordance with claim 1, further comprises a second connecting pad formed on the protective layer, the substrate further comprises a second bond pad electrically connected with the second connecting pad.

3. The method for fabricating a carrier with a three dimensional inductor in accordance with claim 2, wherein the second metal layer comprises a seventh inductive portion in connection with the second connecting pad.

4. The method for fabricating a carrier with a three dimensional inductor in accordance with claim 3, wherein the third metal layer comprises an eighth inductive portion in connection with the fourth inductive portion and the seventh inductive portion.

5. The method for fabricating a carrier with a three dimensional inductor in accordance with claim 1, further comprises a second connecting pad formed on the second dielectric layer, the third metal layer comprises an eighth inductive portion in connection with the second connecting pad and the fourth inductive portion.

6. The method for fabricating a carrier with a three dimensional inductor in accordance with claim 1, further comprises the step of removing the third photoresist layer.

7. The method for fabricating a carrier with a three dimensional inductor in accordance with claim 1, further comprises the step of forming a third dielectric layer on the second dielectric layer an covering the third metal layer with the third dielectric layer.

8. The method for fabricating a carrier with a three dimensional inductor in accordance with claim 1, further comprises the step of forming a nickel/gold protective layer on the third metal layer.