Ultra-flat, high throughput wafer lapping process
First Claim
1. A method for polishing wafers and other substantially thin, rigid materials, comprising the steps of:
- i. utilizing a lapping apparatus having a rotating flat, lapping platen;
at least one pair of rotating pressurized heads;
a plurality of wafer carriers, each adapted to receive at least one mounted wafer;
a plurality of concentric conditioning rings;
at least one wafer to be processed being made from a desired wafer material; and
a slurry dispenser containing slurry to be dispensed;
ii. removably affixing at least one wafer to the polishing wafer carrier;
iii. providing an slurry at a desired flow rate;
iv. selecting and setting a polishing downward force;
v. selecting and setting a polishing time;
vi. selecting and setting a rotational speed for the rotating lapping platen and each rotating pressurized head;
vii. continuously conditioning the lapping platen by rotating the plurality of concentric conditioning rings upon the lapping platen with a desired downward force and overhang; and
viii. operating the lapping apparatus with the plurality of rotating pressurized heads in counterbalanced pairs rotating in both clockwise and counterclockwise directions.
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Accused Products
Abstract
The present invention comprises of a process for lapping a high-throughput of ultra-flat wafers by utilizing a lapping apparatus containing a rotary flat, grooved polishing platen, at least two rotating pressurized heads each having a polishing wafer carrier that is adapted to receive a plurality of mounted wafers, and a plurality of concentric conditioning rings surrounding each pressurized head. The rotating pressurized heads are counterbalanced throughout the inventive process, and the lapping platen is continuously conditioned by simultaneously rotating the concentric conditioning rings over the lapping platen. This process allows continuous and controllable planarization thus allowing for a high throughput of wafers, while at the same time it prevents distortions in the lapping platen which reduces maintenance by providing continuous conditioning of the lapping platen. Further this inventive process allows substantially the entire surface of each wafer carrier to be utilized while maintaining a high quality planarized wafer product, highly desired in the semiconductor industry.
56 Citations
15 Claims
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1. A method for polishing wafers and other substantially thin, rigid materials, comprising the steps of:
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i. utilizing a lapping apparatus having a rotating flat, lapping platen;
at least one pair of rotating pressurized heads;
a plurality of wafer carriers, each adapted to receive at least one mounted wafer;
a plurality of concentric conditioning rings;
at least one wafer to be processed being made from a desired wafer material; and
a slurry dispenser containing slurry to be dispensed;ii. removably affixing at least one wafer to the polishing wafer carrier; iii. providing an slurry at a desired flow rate; iv. selecting and setting a polishing downward force; v. selecting and setting a polishing time; vi. selecting and setting a rotational speed for the rotating lapping platen and each rotating pressurized head; vii. continuously conditioning the lapping platen by rotating the plurality of concentric conditioning rings upon the lapping platen with a desired downward force and overhang; and viii. operating the lapping apparatus with the plurality of rotating pressurized heads in counterbalanced pairs rotating in both clockwise and counterclockwise directions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification