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Encapsulated MEMS device and method to form the same

  • US 8,349,635 B1
  • Filed: 05/20/2008
  • Issued: 01/08/2013
  • Est. Priority Date: 05/20/2008
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • forming a silicon-germanium seal ring on a first substrate on which a MEMS device is disposed inside of a region enclosed by the silicon-germanium seal ring;

    forming a vertical seal ring stack on a second substrate, the vertical seal ring stack including a metal seal ring;

    forming a metal shielding layer on said second substrate including on a sidewall of the vertical seal ring stack;

    bonding said metal seal ring to said silicon-germanium seal ring to provide a sealed cavity that houses the MEMS device, and to electrically couple the MEMS device and the metal shielding layer.

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