Method of bonding two substrates
First Claim
1. A method for reducing edge voids and blisters when forming a structure comprising a thin layer of semiconductor material transferred from a donor substrate onto a second substrate, which method comprises:
- co-implanting two different atomic species into the donor substrate so as to create a weakened zone delimiting the thin layer to be transferred, each of the species having a maximum concentration at a so-called “
peak”
depth, with the two different atomic species implanted so that their peaks are aligned at substantially identical depths; and
molecularly bonding the donor and second substrates together by;
cleaning the surface of one or both of the substrates by means including a chemical bath under conditions selected so that the surface is etched by less than 10 Å
to avoid blister formation during subsequent bonding wave propagation;
heating at least one or both of the substrates to a temperature in the range of 45°
C. to 70°
C. then contacting the substrates;
propagating a bonding wave between the substrates while retaining the substrate temperature in the range of 45°
C. to 70°
C. to reduce or eliminate edge voids during bonding wave propagation; and
transferring part of the donor substrate to the second substrate so as to form the thin layer on the second substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
The invention relates to a method of forming a structure comprising a thin layer of semiconductor material transferred from a donor substrate onto a second substrate, wherein two different atomic species are co-implanted under certain conditions into the donor substrate so as to create a weakened zone delimiting the thin layer to be transferred. The two different atomic species are implanted so that their peaks have an offset of less than 200 Å in the donor substrate, and the substrates are bonded together after roughening at least one of the bonding surfaces.
22 Citations
15 Claims
-
1. A method for reducing edge voids and blisters when forming a structure comprising a thin layer of semiconductor material transferred from a donor substrate onto a second substrate, which method comprises:
-
co-implanting two different atomic species into the donor substrate so as to create a weakened zone delimiting the thin layer to be transferred, each of the species having a maximum concentration at a so-called “
peak”
depth, with the two different atomic species implanted so that their peaks are aligned at substantially identical depths; andmolecularly bonding the donor and second substrates together by; cleaning the surface of one or both of the substrates by means including a chemical bath under conditions selected so that the surface is etched by less than 10 Å
to avoid blister formation during subsequent bonding wave propagation;heating at least one or both of the substrates to a temperature in the range of 45°
C. to 70°
C. then contacting the substrates;propagating a bonding wave between the substrates while retaining the substrate temperature in the range of 45°
C. to 70°
C. to reduce or eliminate edge voids during bonding wave propagation; andtransferring part of the donor substrate to the second substrate so as to form the thin layer on the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
Specification