Miniaturized optical proximity sensor
First Claim
1. An optical proximity sensor, comprising:
- a substrate comprising a plurality of wire bond pads;
an infrared light emitter mounted atop the substrate and electrically connected to at least one of the wire bond pads;
a light detector mounted atop the substrate and electrically connected to at least one of the wire bond pads;
an integrated circuit mounted atop the substrate, the integrated circuit comprising light emitter driving and light detecting circuits operably connected to the light emitter and the light detector, respectively, the integrated circuit being operably connected to some of the plurality of wire bond pads;
at least one spacer comprising an electrically non-conductive dielectric material, the spacer being mounted to a top surface of the integrated circuit;
an ambient light sensor mounted to a top surface of the spacer, the ambient light sensor being electrically connected to at least one of the wire bond pads, wherein the light detector is mounted to the top surface of the spacer;
a first molded infrared light pass component disposed over and covering the light emitter;
a second molded infrared light pass component disposed over and covering the ambient light sensor and the light detector, anda molded infrared light cut component disposed over and between the first and second molded infrared light pass components and over portions of the substrate, the molded infrared light cut component having first, second and third apertures disposed therethrough above the light emitter, the ambient light sensor, and the light detector, respectively.
8 Assignments
0 Petitions
Accused Products
Abstract
Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, a light emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.
69 Citations
28 Claims
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1. An optical proximity sensor, comprising:
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a substrate comprising a plurality of wire bond pads; an infrared light emitter mounted atop the substrate and electrically connected to at least one of the wire bond pads; a light detector mounted atop the substrate and electrically connected to at least one of the wire bond pads; an integrated circuit mounted atop the substrate, the integrated circuit comprising light emitter driving and light detecting circuits operably connected to the light emitter and the light detector, respectively, the integrated circuit being operably connected to some of the plurality of wire bond pads; at least one spacer comprising an electrically non-conductive dielectric material, the spacer being mounted to a top surface of the integrated circuit; an ambient light sensor mounted to a top surface of the spacer, the ambient light sensor being electrically connected to at least one of the wire bond pads, wherein the light detector is mounted to the top surface of the spacer; a first molded infrared light pass component disposed over and covering the light emitter; a second molded infrared light pass component disposed over and covering the ambient light sensor and the light detector, and a molded infrared light cut component disposed over and between the first and second molded infrared light pass components and over portions of the substrate, the molded infrared light cut component having first, second and third apertures disposed therethrough above the light emitter, the ambient light sensor, and the light detector, respectively. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of making an optical proximity sensor, comprising:
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mounting an infrared light emitter atop a substrate comprising a plurality of wire bond pads and electrically connecting the light emitter to at least one of the wire bond pads; mounting a light detector atop the substrate and electrically connecting the light detector to at least one of the wire bond pads; mounting an integrated circuit atop the substrate, the integrated circuit comprising light emitter driving and light detecting circuits operably connected to the light emitter and the light detector, respectively, and electrically connecting the integrated circuit to some of the plurality of wire bond pads; mounting at least one spacer comprising an electrically non-conductive dielectric material to a top surface of the integrated circuit; mounting an ambient light sensor to a top surface of the spacer, and electrically connecting the ambient light sensor to at least one of the wire bond pads, wherein the mounting of the light detector includes mounting the light detector to the top surface of the spacer; molding or casting a first infrared light pass component over the light emitter; molding or casting a second infrared light pass component over the ambient light sensor and the light detector, and molding or casting an infrared light cut component over and between the first and second infrared light pass components and over portions of the substrate, the molded infrared light cut component having first, second and third apertures disposed therethrough above the light emitter, the ambient light sensor, and the light detector, respectively. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification