Electronic circuit

• US 8,350,259 B2
• Filed: 05/29/2009
• Issued: 01/08/2013
• Est. Priority Date: 05/30/2008
• Status: Active Grant

• Current Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Original Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Inventors: Knobloch, Alexander, Fix, Walter
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US12/994,170
• Publication Number:
  US 20110115101A1
• Time in Patent Office: 1,320 Days
• Field of Search: 257/750, 257/781, 257/E23.116, 257/685, 257/723, 257/E25.005, 257/E25.011, 257/E25.012, 257/E25.016, 257/E25.026, 257/464, 257/759, 257/773, 257/E23.114, 257/E23.119, 257/E23.132, 257/40, 257/103, 257/E51.005, 257/E51.024, 313/504, 136/263
• US Class Current: 257/40
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/09763 Printed component having superposed conductors, but integrated in one circuit layer
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H10K 19/10 comprising field-effect transistors
• CPC Class Codes: H10K 71/233 by photolithographic etching

Abstract

An electronic circuit includes at least two organic components interconnected by conductor tracks and having a common carrier substrate. The components and the conductor tracks are formed from layer portions. An uppermost layer portion, remote from the carrier substrate, of the electronic circuit is of a patterned configuration comprising an electrically conducting material. The patterned uppermost layer portion on its side remote from the carrier substrate is provided with at least one protective layer arranged in congruent relationship with the uppermost layer portion. The at least two organic components include at least one first component of a first component type and at least one second component of a second component type different therefrom. Components of the same component type are respectively protected by a protective layer of the same composition and/or the same structure corresponding to that component type and differing from one another according to the corresponding component type.

Claims

1. An electronic circuit having opposite sides comprising:

a carrier substrate;

at least two organic components interconnected by conductor tracks and located on the carrier substrate,

the at least two organic components and the conductor tracks being formed from layer portions including an uppermost layer portion remote from the carrier substrate, which uppermost layer portion has a patterned configuration comprising an electrically conducting material and having a side remote from the carrier substrate;

the patterned uppermost layer portion side remote from the carrier substrate having at least one protective layer in congruent relationship with the uppermost layer portion;

the at least two organic components including at least one first component of a first component type and at least one second component of a second component type different from the first type;

wherein components of the same component type are respectively protected by a protective layer of the same composition and/or the same structure; and

the at least one protective layer for covering the full surface of a side of the circuit and/or at least one film for covering the full surface area of a side of the circuit arranged on the side of the circuit that is remote from the carrier substrate.

2. The electronic circuit as set forth in claim 1 wherein the at least two organic components respectively include at least one printed layer portion.

3. The electronic circuit as set forth in claim 1 wherein the at least two organic components include at least two components of the same component type.

4. The electronic circuit as set forth in claim 1 wherein the at least two organic components include component types in the form of field effect transistors, diodes, capacitors, resistors, IC chips or vias.

5. The electronic circuit as set forth in claim 1 wherein the at least one protective layer in the region of the electronic circuit is everywhere of the same composition and/or the same structure.

6. The electronic circuit as set forth in claim 1 wherein the at least one protective layer in the region of the electronic circuit is of a different composition and/or a different structure corresponding to the different component types.

7. The electronic circuit as set forth in claim 6 wherein components of differing component type are respectively protected by at least one protective layer, the composition and/or structure of which differs according to the corresponding component type.

8. The electronic circuit as set forth in claim 5 wherein the at least one protective layer has at least region-wise a structure corresponding to a given component region and comprising at least two Individual protective layers arranged in mutually superposed stacked relationship.

9. An electronic circuit as set forth in claim 1 wherein the at least one protective layer is printed.

10. The electronic circuit as set forth in claim 1 wherein the at least one protective layer is organic.

11. The electronic circuit as set forth in claim 10 wherein the at least one protective layer is formed from a crosslinked organic material.

12. The electronic circuit as set forth in claim 1 wherein the at least one protective layer is impermeable to visible radiation and/or ultraviolet radiation.

13. The electronic circuit as set forth in claim 1 wherein the at least one protective layer has a modulus of elasticity in the range of between 0.5 and 5000 N/mm².

14. An electronic circuit as set forth in claim 1 wherein the at least one protective layer is resistant to at least one organic solvent.

15. An electronic circuit as set forth in claim 1 wherein the at least one protective layer is insoluble in water.

16. The electronic circuit as set forth in claim 1 wherein the at least one protective layer is impervious to water vapor and/or oxygen.

17. The electronic circuit as set forth in claim 1 wherein the carrier substrate is a flexible film.

18. The electronic circuit as set forth in claim 17 wherein the film includes at least one film layer of at least one material comprising plastic, glass, paper, metal or a laminate comprising at least two different film layers of said materials.