Display device and sputtering target for producing the same
First Claim
1. A display device in which an Al alloy film and a conductive oxide film are directly connected without interposition of refractory metal,wherein the Al alloy film comprises 0.1 to 6 at % of at least one element selected from the group consisting of Ni, Ag, Zn, Cu, and Ge, 0.1 to 2 at % of Mg, and at least one element selected from the group consisting of Cr, Mn, Ru, Rh, Pd, Ir, Pt, La, Ce, Pr, Gd, Tb, Sm, Eu, Ho, Er, Tm, Yb, Lu, and Dy as alloy components, andwherein the at least one element selected from the group consisting of Ni, Ag, Zn, Cu, and Ge are concentrated at an interface of contact between the Al alloy film and the conductive oxide film in a layer having a thickness of from 1 to 5 nm.
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Abstract
A display device in which an Al alloy film and a conductive oxide film are directly connected without interposition of refractory metal and some or all of Al alloy components deposit or are concentrated at the interface of contact between the Al alloy film and the conductive oxide film. The Al alloy film contains 0.1 to 6 at % of at least one element selected from the group consisting of Ni, Ag, Zn, Cu and Ge, and further contains 1) 0.1 to 2 at % of at least one element selected from the group consisting of Mg, Cr, Mn, Ru, Rh, Pd, Ir, Pt, La, Ce, Pr, Gd, Tb, Sm, Eu, Ho, Er, Tm, Yb, Lu and Dy or 2) 0.1 to 1 at % of at least one element selected from the group consisting of Ti, V, Zr, Nb, Mo, Hf, Ta and W, as the alloy components.
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Citations
12 Claims
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1. A display device in which an Al alloy film and a conductive oxide film are directly connected without interposition of refractory metal,
wherein the Al alloy film comprises 0.1 to 6 at % of at least one element selected from the group consisting of Ni, Ag, Zn, Cu, and Ge, 0.1 to 2 at % of Mg, and at least one element selected from the group consisting of Cr, Mn, Ru, Rh, Pd, Ir, Pt, La, Ce, Pr, Gd, Tb, Sm, Eu, Ho, Er, Tm, Yb, Lu, and Dy as alloy components, and wherein the at least one element selected from the group consisting of Ni, Ag, Zn, Cu, and Ge are concentrated at an interface of contact between the Al alloy film and the conductive oxide film in a layer having a thickness of from 1 to 5 nm.
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2. A display device in which an Al alloy film and a conductive oxide film are directly connected without interposition of refractory metal,
wherein the Al alloy film comprises 0.1 to 6 at % of at least one element selected from the group consisting of Ni, Ag, Zn, Cu, and Ge, 0.1 to 1 at % of Ti, and at least one element selected from the group consisting of V, Zr, Nb, Mo, Hf, Ta, and W as alloy components, and wherein the at least one element selected from the group consisting of Ni, Ag, Zn, Cu, and Ge are concentrated at an interface of contact between the Al alloy film and the conductive oxide film in a layer having a thickness of from 1 to 5 nm.
Specification